Preparation and Properties of Cu-Containing High-entropy Alloy Nitride Films by Magnetron Sputtering on Titanium Alloy

Abstract

Magnetron sputtering deposition with regulated Cu target power was used for depositing Cucontaining high-entropy alloy nitride (Cu-(HEA)N) films on TC4 titanium alloy substrates. The microscopic morphologies, surface compositions, and thicknesses of the films were characterized using SEM+EDS; the anti-corrosion, wear resistance and antibacterial properties of the films in simulated seawater were investigated. The experimental results show that all four Cu-(HEA)N films are uniformly dense and contained nanoparticles. The film with Cu doping come into contact with oxygen in the air to form cuprous oxide. The corrosion resistance of the (HEA)N film without Cu doping on titanium alloy is better than the films with Cu doping. The Cu-(HEA) N film with Cu target power of 16 W shows the best wear resistance and antibacterial performance, which is attributed to the fact that Cu can reduce the coefficient of friction and exacerbate corrosion, and the formation of cuprous oxide has antibacterial properties. The findings of this study provide insights for engineering applications of TC4 in the marine field.

Keywords

titanium alloy / high-entropy alloy nitride film / magnetron sputtering / properties

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