Improvement of AlN Thermal Conductivity Based on Reductive Compound Additives

Abstract

AlN ceramics were prepared by plasma activation sintering (PAS) with compound additives yttrium acetylacetonate (Y(acac)₃) and melamine (C₃H₆N₆). The effects of compound additives on the microstructure, density, and thermal properties of AlN ceramic were studied. Y(acac)₃ and C₃H₆N₆ can form Y₂O₃, residual organic carbon and reducing gas during the heating process, which improves the AlN sintering performance at a temperature of 1 700 °C and the bulk thermal conductivity. When the content of Y(acac)₃ is 10 wt% and C₃H₆N₆ is 3 wt%, the thermal conductivity of AlN ceramics is 105.6 W/(m·K), which is much higher than that of AlN ceramics with Y₂O₃ under the same sintering conditions. This work provides theoretical reference for the preparation of high-performance AlN ceramic.

Keywords

reductive compound additives / AlN ceramic / thermal conductivity / plasma activated sintering

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