Preparation of B2O3-ZnO-SiO2 Glass and Sintering Densification of Copper Terminal Electrode Applied in Multilayer Ceramic Capacitors

Yi Yue , Hong Li , Xiuhua Cao , Xuehui Zhang , Jun Huang , Xuye Huang , Yongqiang Zhang , Ruipeng Xu , Dehua Xiong

Journal of Wuhan University of Technology Materials Science Edition ›› 2023, Vol. 38 ›› Issue (5) : 960 -968.

PDF
Journal of Wuhan University of Technology Materials Science Edition ›› 2023, Vol. 38 ›› Issue (5) : 960 -968. DOI: 10.1007/s11595-023-2783-4
Advanced Materials

Preparation of B2O3-ZnO-SiO2 Glass and Sintering Densification of Copper Terminal Electrode Applied in Multilayer Ceramic Capacitors

Author information +
History +
PDF

Abstract

B2O3-ZnO-SiO2(BZS) glass containing CuO with excellent acid resistance, wetting properties, and high-temperature sintering density was prepared by high temperature melting method and then applied in copper terminal electrode for multilayer ceramic capacitors (MLCC) applications. The structure and property characterization of B2O3-ZnO-SiO2 glass, including X-ray diffraction, FTIR, scanning electron microscopy, high-temperature microscopy, and differential scanning calorimetry, indicated that the addition of CuO improved the glass’s acid resistance and glass-forming ability. The wettability and acid resistance of this glass were found to be excellent when CuO content was 1.50 wt%. Compared to BZS glass, the CuO-added glass exhibited excellent wettability to copper powder and corrosion resistance to the plating solution. The sintered copper electrode films prepared using the glass with CuO addition had better densification and lower sintering temperature of 750 °C. Further analysis of the sintering mechanism reveals that the flowability and wettability of the glass significantly impact the sintering densification of the copper terminal electrodes.

Keywords

B2O3-ZnO-SiO2(BZS) / low melting glass / MLCC / densification / copper terminal electrode

Cite this article

Download citation ▾
Yi Yue, Hong Li, Xiuhua Cao, Xuehui Zhang, Jun Huang, Xuye Huang, Yongqiang Zhang, Ruipeng Xu, Dehua Xiong. Preparation of B2O3-ZnO-SiO2 Glass and Sintering Densification of Copper Terminal Electrode Applied in Multilayer Ceramic Capacitors. Journal of Wuhan University of Technology Materials Science Edition, 2023, 38(5): 960-968 DOI:10.1007/s11595-023-2783-4

登录浏览全文

4963

注册一个新账户 忘记密码

References

[1]

Paik U, Kang K M, Jung Y G, et al. Binder Removal and Microstructure with Burnout Conditions in BaTiO3 Based Ni-MLCCs[J]. Ceramics International, 2003, 29(8): 939-946.

[2]

Akhtar M, Anklekar R M. Characterization of Copper Pastes for End Termination Application of Base Metal Electrode MLCCs[J]. Microelectronics International, 2004, 21(2): 36-40.

[3]

Guangguang L, Tianpeng X. Development Tendency and Research Progress of the Electronic Paste[J]. Metallic Functional Materials, 2008, 15(1): 48-52.

[4]

Hong K, Lee T H, Suh J M, et al. Perspectives and Challenges in Multilayer Ceramic Capacitors for Next Generation Electronics[J]. Journal of Materials Chemistry C, 2019, 7(32): 9782-9802.

[5]

Kishi H, Mizuno Y, Chazono H. Base-metal Electrode-multilayer Ceramic Capacitors: Past, Present and Future Perspectives[J]. Japanese Journal of Applied Physics, 2003, 42(1R): 1

[6]

Nishioka N, Hosono Y, Sukenaga S, et al. Effect of Glass Composition on Sinterability of Copper Terminal Paste for Multilayer Ceramic Capacitors[J]. Materials Transactions, 2021, 62(10): 1583-1588.

[7]

Gan R, Li J, Cao X, et al. Mixed Solvents in Multilayer Ceramic Capacitors (MLCC) Electronic Paste and Their Effects on the Properties of Organic Vehicle[J]. Polymers, 2022, 14(4): 685

[8]

Dmitrieva A V, Gordeev P S, Gallai I Y. Investigation of the Pastes for Multilayer Ceramic Capacitors Termination[C]. Key Engineering Materials, Trans Tech Publications Ltd, 2019

[9]

Jeong D Y, Lee S, Lee H Y, et al. Electrical Properties of BaTiO3-based Multilayer Ceramic Capacitors Sintered with Plasma-treated Glass Powder[J]. Japanese Journal of Applied Physics, 2013, 52(10S): 10MB23

[10]

Denry I, Holloway J A. Low Temperature Sintering of Fluorapatite Glass-ceramics[J]. Dental Materials, 2014, 30(2): 112-121.

[11]

Lee K H, Jeon B J, Kim C H, et al. Effects of Glass Frit Size on the Sintering Behavior of Cu Termination Paste in MLCC[J]. Journal of the Korean Ceramic Society, 2009, 46(2): 175-180.

[12]

Tachibana Y, Matsuda A, Yoshimoto M. Effect of MgO Powder Addition to Alkali and Alkaline-earth Borosilicate Glass Paste on the Acid Durability and Peel Adhesion Characteristics of Ag Conductors Formed with the Glass Paste[J]. Journal of the Ceramic Society of Japan, 2020, 128(3): 142-148.

[13]

Liu X, Hou Y, Song B, et al. Lead-free Multilayer Ceramic Capacitors with Ultra-wide Temperature Dielectric Stability Based on Multifaceted Modification[J]. Journal of the European Ceramic Society, 2022, 42(3): 973-980.

[14]

Gan W P, Zhou H, Zhang J L. Investigation of Sintering Process and Electrical Conductivity of the Lead-free Ag Paste[J]. Electron. Compon. Mater., 2010, 29: 65-69.

[15]

Ma X, Zhu X, Long J, et al. Research Status and Development Tendency of Sintering Process for Electronic Paste[J]. Hot Working Technology, 2017, 46(18): 14-19.

[16]

Shi F, Chen H, Wang J. Liquid-phase Preparation of BaTiO3 Nanoparticles[J]. IET Nanodielectrics, 2020, 3(4): 107-115.

[17]

Buscaglia V, Randall C A. Size and Scaling Effects in Barium Titanate. An Overview[J]. Journal of the European Ceramic Society, 2020, 40(11): 3744-3758.

[18]

Zhang B. Preparation and Oroperties of Glass-coated Copper Conductive Paste for Low Temperature Cofired Ceramics[D], 2019 Tianjin: Tianjin University.

[19]

R Haidong, C Xiuhua, Z Feng. Application of Low-temperature Lead-Free Glass of Different Systems in Copper Terminal Electrode Paste[J]. Electrical Engineering Materials, 2021(02):6–9

[20]

Shao H, Zhou H Q, Shen X D. The Influence of B2O3 on the Microstructures and Properties of CaO-B2O3-SiO2-Al2O3 Glass-Ceramics (α-Al2O3 ) System[C]. Advanced Materials Research, Trans Tech Publications Ltd, 2011

[21]

Jun H, Xiuhua C, Lijian N, et al. Low Temperature Sintered Copper Paste and Its Sintering Characteristics for Terminal Electrode of Multilayer Ceramic Capacitors[J]. Electronic Components and Materials, 2022, 41(2): 213-220.

[22]

Li X, Xiao Z, Luo M, et al. Low Melting Gllasses in ZnO-Fe2O3-P2O5 System With High Chemical Durability and Thermal Stability for Sealing or Waste Immobilization[J]. Journal of Non-Crystalline Solids, 2017, 469: 62-69.

[23]

Bao R, Busta C M, Su X, et al. Microstructures, Phases, and Properties of Low Melting BaO-B2O3-ZnO Glass Films Prepared by Pulsed Laser Deposition[J]. Journal of Non-crystalline Solids, 2013, 371: 28-32.

[24]

Selivanov E N, Vusikhis A S, Sergeeva S V, et al. Thermal Properties of Glass and Melts of the CaO-B2O3-Al2O3-CuO System[J]. Glass Physics and Chemistry, 2021, 47: 97-103.

[25]

Yan D, He F, Cao X, et al. Effect of BaO on the Structure and Properties of Bismuth-based Low-melting Glasses[J]. Advances in Applied Ceramics, 2020, 119(8): 439-447.

[26]

Abdelghany A M, Rammah Y S. Transparent Alumino Lithium Borate Glass-ceramics: Synthesis, Structure and Gamma-ray Shielding Attitude[J]. Journal of Inorganic and Organometallic Polymers and Materials, 2021, 31: 2560-2568.

[27]

Molla A R, Rodrigues A M, Singh S P, et al. Crystallization, Mechanical, and Optical Properties of Transparent, Nanocrystalline Gahnite Glass-ceramics[J]. Journal of the American Ceramic Society, 2017, 100(5): 1963-1975.

[28]

Shi J, He F, Xie J, et al. Effect of Heat Treatments on the Li2O-Al2O3-SiO2-B2O3-BaO Glass-ceramic Bond and the Blass-ceramic Bond cBN Grinding Tools[J]. International Journal of Refractory Metals and Hard Materials, 2019, 78: 201-209.

[29]

Zhang F, Duan G, Cao L, et al. Preparation and Properties of Antioxidative BaO-B2O3-SiO2 Glass-coated Cu Powder for Copper Conductive Film on LTCC Substrate[J]. Journal of Materials Science: Materials in Electronics, 2018, 29: 130-137.

[30]

Hong Y J, Jung D S, Koo H Y, et al. Characteristics of ZnO-B2O3-SiO2-CaO Glass Frits Prepared by Spray Pyrolysis as Inorganic Binder for Cu Electrode[J]. Journal of Alloys and Compounds, 2011, 509(31): 8077-8081.

[31]

Zhang W, Chen L, Xu C, et al. Grain Growth Kinetics and Densification Mechanism of (TiZrHfVNbTa) C High-entropy Ceramic Under Pressure Less Sintering[J]. Journal of Materials Science & Technology, 2022, 110: 57-64.

[32]

Ponton S, Dhainaut F, Vergnes H, et al. Investigation of the Densification Mechanisms and Corrosion Resistance of Amorphous Silica Films[J]. Journal of Non-Crystalline Solids, 2019, 515: 34-41.

[33]

Fan J, Xu D, Zhang H, et al. Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-power Electronic Packaging[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(7): 1101-1109.

[34]

Luque A, Aldazabal J, Martínez-Esnaola J M, et al. Geometrical Monte Carlo Model of Liquid-phase Sintering[J]. Mathematics and Computers in Simulation, 2010, 80(7): 1469-1486.

[35]

Zhang H Q, Bai H L, Jia Q, et al. High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications[J]. Acta Metallurgica Sinica (English Letters), 2020, 33: 1543-1555.

AI Summary AI Mindmap
PDF

109

Accesses

0

Citation

Detail

Sections
Recommended

AI思维导图

/