Effect of Particle Size on Silicon Nitride Ceramic Slurry by Stereolithography

Abstract

The effects of particle size, gradation and solid loading of silicon nitride (Si₃N₄) on the rheological behavior and curing properties of ceramic slurry are studied by stereolithography (SLA). The results show that the particle size of Si₃N₄ powder has a significant influence on the rheological properties and stability of the slurry. When m _{D50 = 13 µm}:m _{D50 = 23 µm} = 3:7, the slurry viscosity is low and the sedimentation is slow. The most important thing is that with the increase of the solid loading of the slurry, the viscosity of the slurry increases, the stability becomes higher, and the curing thickness decreases. The curing thickness of Si₃N₄ ceramic slurry with solid loading of 50 vol% can reach nearly 50 µm. The above results finally show that the process optimizes the formulation of the slurry in rheological and curing properties.

Keywords

silicon nitride / stereolithography;dispersion / stability

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