Influence of Bi Addition on Pure Sn Solder Joints: Interfacial Reaction, Growth Behavior and Thermal Behavior

Abstract

The effects of different Bi contents on the properties of Sn solders were studied. The interfacial reaction and growth behavior of intermetallic compounds (IMCs) layer (η-Cu₆Sn₅ + ε-Cu₃Sn) for various soldering time and the influence of Bi addition on the thermal behavior of Sn-xBi solder alloys were investigated. The Cu₆Sn₅ IMC could be observed as long as the molten solder contacted with the Cu substrate. However, with the longer welding time such as 60 and 300 s, the Cu₃Sn IMC was formed at the interface between Cu₆Sn₅ and Cu substrate. With the increase of soldering time, the thickness of total IMCs increased, meanwhile, the grain size of Cu₆Sn₅ also increased. An appropriate amount of Bi element was beneficial for the growth of total IMCs, but excessive Bi (⩾ 5 wt%) inhibited the growth of Cu₆Sn₅ and Cu₃Sn IMC in Sn-xBi/Cu microelectronic interconnects. Furthermore, with the Bi contents increasing (Sn-10Bi solder in this present investigation), some Bi particles accumulated at the interface between Cu₆Sn₅ layer and the solder.

Keywords

intermetallic compound / Sn-xBi solder joints / interfacial reaction / thermal behavior

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