Microstructure and thermal properties of SiCp/Cu composites with Mo coating on SiC particles

Abstract

SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of SiCp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the SiCp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. SiCp/Cu composites with a maximum thermal conductivity of 274.056 W/(m·K) and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these SiCp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.

Keywords

SiCp/Cu composites / hot-pressing / magnetron sputtering / molybdenum coating / thermal conductivity

References

[1] Schubert T, Trindade B. Interfacial Design of Cu-based Composites Prepared by Powder Metallurgy for Heat Sink Applications[J]. Mater Sci. Eng. A, 2008, 475(122): 39-44.

[2] Schubert T, Brendel A, Schmid K, et al. Interfacial Design of Cu/SiC Composites Prepared by Powder Metallurgy for Heat Sink Applications[J]. Composites Part A, 2007, 38: 2398-2403.

[3] Pradeep Cherian Paul. Fabrication and Characterization of CuSiC Metal Matrix Composite[D]. 2004 Massachusetts: University of Massachusetts Lowell.

[4] Wang C C, Min G H, Kang S B. Thermal Conducting Property of SiC_p-reinforced Cu Matrix Composites by Hot Pressing[J]. J. Compos. Mater., 2011, 45(18): 1849-1852.

[5] Celebi Efe G, Altinsoy I. Characterization of Cemented Cu Matrix Composites Reinforced with SiC[J]. Vacuum, 2010, 85: 643-647.

[6] Feng H, Yu J K, Tan W. Microstructure and Thermal Properties of Diamond/Aluminum Composites with TiC Coating on Diamond Particles[J]. Materials Chemistry and Physics, 2010, 124: 851-855.

[7] Zhang L. Thermo-physical and Mechanical Properties of High Volume Fraction SiC_p/Cu Composites Prepared by Pressureless Infiltration[J]. Materials Science and Engineering A, 2008, 489: 285-293.

[8] Shu K M. The microstructure and the Thermal Expansion Characteristics of Cu/SiC_p Composites[J]. Materials Science and Engineering A, 2003, 349: 236-247.

[9] Pradeep Cherian Paul. Fabrication and Characterization of CuSiC Metal Matrix Composite[D]. 2004 Massachusetts: University of Massachusetts Lowell.

[10] Lin Zhang. Microstructure and Thermo-mechanical Properties of Pressureless Infiltrated SiCp/Cu Composites[J]. Composites Science and Technology, 2008, 68: 2731-2738.

[11] Zhan Y, Zhang Guoding. The Effect of Interfacial Modifying on The Mechanical and Wear Properties of SiC_p/Cu Composites[J]. Materials Letters, 2003, 57: 4583-4591.

[12] YU X-z, XU Z, SHEN Z-gang. Preparation and Characterization of Metal-coated Micro-particles by Magnetron Sputtering[J]. The Chinese Journal of Process Engineering Dec., 2006, 6(2): 173-178.

[13] Sundberg G, Paul P, Sung C. Identification and Characterization of Diffusion Barriers for Cu/SiC Systems[J]. J. Mater. Sci., 2005, 40(3): 383-393.

[14] CHEN G-qin. Thermal Expansion and Mechanical Properties of High Reinforcement Content SiC_p/Cu Composites Fabricated by Squeeze Casting Technology[J]. Transactions of Nonferrous Metals Society of China, 2009, 19: 600-604.

[15] Weidenmann K A, Tavangar R, Weber L. Mechanical Behavior of Diamond Reinforced Metals[J]. Materials Science and Engineering A, 2009, 523: 226-234.

[16] Martinez V, Ordonez S, Castro F, et al. Wetting of Silicon Carbide by Copper Alloys[J]. Journal of Materials Science, 2003, 38(19): 4047-4054.

[17] Zhang L, Qu X. Microstructure and Thermo-mechanical Properties of Pressureless Infiltrated SiC_p/Cu Composites[J]. Composites Science and Technology, 2008, 68: 2731-2738.

[18] Shu K-M, Tu G C. The Microstructure and The Thermal Expansion Characteristics of Cu/SiC_p Composites[J]. Materials Science and Engineering A, 2003, 349: 236-247.

[19] YU X-z, XU Z, SHEN Z-gang. Preparation and Characterization of Metal-coated Micro-particles by Magnetron Sputtering[J]. The Chinese Journal of Process Engineering Dec., 2006, 6(2): 173-178.

[20] John H Scofield. Sputtered Molybdenum Bilayer Back Contact for Copper Indium Diselenide Based Polycrystailine Thin Film Solar Cells[J]. Thin Solid Films, 1995, 260: 26-31.

[21] Kang H-K, Kang S Bong. Thermal Decomposition of Silicon Carbide in a Plasma-sprayed Cu/SiC Composite Deposit[J]. Materials Science and Engineering A, 2006, 428: 336-345.

[22] Wang Z, Wynblatt P. Study of a Reaction at The Solid Cu/α-SiC Interface[J]. Journal of Materials Science, 1998, 33(5): 1177-1181.

[23] Davis LC, Artz BE. Thermal Conductivity of Metal Matrix Composites[J]. Journal of Applied Physics, 1995, 77(10): 4954-4960.