Nanocomposites of a silicon-containing arylacetylene resin with octakis(dimethylsiloxy)octasilsesquoixane

Abstract

Nanocomposites (PMSEPE/Q₈M₈ ^H) were prepared via solution blending of octakis(dimethylsiloxy)octasilsesquoixane (Q₈M₈ ^H) into poly(dimethylsilyleneethynylenephenyleneethynyle ne) (PMSEPE). PMSEPE/Q₈M₈ ^H nanocomposites were characterized by Fourier transform infrared (FT-IR) spectroscopy, rheological measurement, differential scanning calorimetry (DSC), scanning electron microscopy (SEM) and thermal gravimetric analysis (TGA). The experimental results show that the hydrosilylation reaction in PMSEPE/Q₈M₈ ^H nanocomposites occurs slowly exceeding 180 °C. PMSEPE/Q₈M₈ ^H nanocomposites can be cured at temperatures less than 260 °C and the cube structure of Q₈M₈ ^H keeps stable during the curing process. POSS domains are evenly dispersed in the cured nanocomposite. However, serious aggregation of POSS occurs at 15% Q₈M₈ ^H content. The thermal and thermooxidative stabilities of PMSEPE/Q₈M₈ ^H nanocomposites obviously depend on the content of Q₈M₈ ^H. The incorporation of Q₈M₈ ^H can effectively enhance the thermal and thermooxidative stabilities of cured PMSEPE. PMSEPE/Q₈M₈ ^H nanocomposites can be the candidates for applications in high temperature environment.

Keywords

silicon-containing arylacetylene resin / POSS / nanocomposite / thermal stability / hydrosilylation

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