Morphology structure and electrical properties of NiCr thin film grown on the substrate of silicon prepared by magnetron sputtering

Bizhou Shen; Liping Peng; Xuemin Wang; Jianjun Wei; Weidong Wu

doi:10.1007/s11595-015-1156-z

Journal of Wuhan University of Technology Materials Science Edition ›› 2015, Vol. 30 ›› Issue (2) : 380 -385. DOI: 10.1007/s11595-015-1156-z

Metallic Materials

Morphology structure and electrical properties of NiCr thin film grown on the substrate of silicon prepared by magnetron sputtering

Author information +

History +

PDF

Abstract

NiCr micron-resistor was designed and prepared by magnetron sputtering and lithography on the substrate of silicon with different powers. It is found that there exists a big gap in the TCR between the annealed group and the un-annealed group. A series of tests were made to figure out the reasons lying behind the gap in the TCR between the annealed group and the un-annealed group. UV reflection results show that there is no increase in the concentration of free electrons after annealing. However, the data obtained from XRD reveal that the annealing does not have an obvious influence on the strain of thin films, but really increases the grain size of thin films. Therefore, the grain boundary scattering plays a dominant role in explaining the obvious difference in the TCR. Finally through appropriate methods, a micron-resistor for heating-up with a low TCR value was obtained.

Keywords

Ni-Cr alloy thin film / resistivity / TCR

Cite this article

Download citation ▾

Bizhou Shen, Liping Peng, Xuemin Wang, Jianjun Wei, Weidong Wu. Morphology structure and electrical properties of NiCr thin film grown on the substrate of silicon prepared by magnetron sputtering. Journal of Wuhan University of Technology Materials Science Edition, 2015, 30(2): 380-385 DOI:10.1007/s11595-015-1156-z

登录浏览全文

4963

注册一个新账户忘记密码

References

Publishing order | Descend order by publishing year | Descend order by cited within

[1]	Kwon Y, Kim NH, Choi GP, et al. Structural and Surface properties of NiCr Thin Films Prepared by DC Magnetron Sputtering under Variation of Annealing Conditions [J]. Microelectron. Eng., 2005, 82: 314-320.

[2]	Epling WS, Hoflund GB. Oxidation Study of a Polycrystalline Ni/Cr Alloy IV.400 °C Anneal in Air [J]. Thin Solid Films, 1997, 292: 236-240.

[3]	Lai LF, Zeng WJ, Fu XZ, et al. Optimization of Sputtering Parameters for Ni-Cr Alloy Deposition on Copper Foil as Embedded Thin Film Resistor [J]. Surfcoat, 2013, 218: 80-86.

[4]	Mayadas AF, Shatzkes M. Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces [J]. Phys. Rev. B, 1970, 1: 1382-1389.

[5]	Ziman JM. Principles of the Theory of Solids (2nd edition) [M], 2006 220-224.

[6]	Ma QB, He HP, Ye ZZ, et al. Effects of Mg Doping on the Properties of Highly Transparent Conductive and Near Infrared Reflective Zn_1−x Mg_xO:Ga Films [J]. J.Solid.State. Chem., 2008, 181: 525-529.

[7]	Peng LP, Fang L, Yang XF, et al. Effect of Annealing Temperature on the Structure and Optical Properties of In-doped ZnO Thin Films [J]. J.Alloys.Compd., 2009, 484: 575-579.

[8]	Sun T, Yao B, Warren AP, et al. Dominant Role of Grain Boundary Scattering in the Resistivity of Nanometric Cu Films [J]. Phys. Rev. B, 2009, 79: 041402-1-041402-4.