Synthesis of Cu nano-particle in toluene used for conductive ink with a binder of polyurethane

Abstract

Copper nanoparticles with a size of about 150 nm were prepared in toluene using oleic acid as protecting agent. The nanoparticles were used to prepare conductive Cu ink with a polyurethane binder. Oleic acid was used to prevent the nanoparticles from oxidization and agglomeration. The prepared Cu nanoparticles were characterized by X-ray diffraction (XRD) and transmission electron microscopy (TEM). The resistivity of the copper film on glass substrate that was prepared using Cu nanoparticle ink reached about 1.5 × 10⁻⁴ Ω· cm⁻¹ after it was annealed to 120 °C. Both the nanoparticle ink and the films were characterized by XRD, fourier transform infrared (FT-IR), and the thermogravimetry-differential scanning calorimetry instrument (TGDSC).

Keywords

copper nanoparticles / oleic acid / toluene / conductive ink / copper film

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