Effects of annealing on microstructure, mechanical and electrical properties of AlCrCuFeMnTi high entropy alloy

Zhisheng Nong , Jingchuan Zhu , Xiawei Yang , Hailing Yu , Zhonghong Lai

Journal of Wuhan University of Technology Materials Science Edition ›› 2013, Vol. 28 ›› Issue (6) : 1196 -1200.

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Journal of Wuhan University of Technology Materials Science Edition ›› 2013, Vol. 28 ›› Issue (6) : 1196 -1200. DOI: 10.1007/s11595-013-0844-9
Metallic Materials

Effects of annealing on microstructure, mechanical and electrical properties of AlCrCuFeMnTi high entropy alloy

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Abstract

The multi-component AlCrCuFeMnTi high entropy alloy was prepared using a vacuum arc melting process. Serial annealing processes were subsequently performed at 590 °C, 750 °C, 955 °C and 1 100 °C respectively with a holding time of 4 h at each temperature. The effects of annealing on microstructure, mechanical and electrical properties of as-cast alloy were investigated by using differential thermal analysis (DTA), X-ray diffraction (XRD), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The experimental results show that two C14 hexagonal structures remain unchanged after annealing the as-cast AlCrCuFeMnTi alloy specimens being heated to 1 100 °C. Both annealed and as-cast microstructures show typical cast-dendrite morphology and similar elemental segregation. The hardness of alloys declines as the annealing temperature increases while the strength of as-cast alloy improves obviously by the annealing treatment. The electrical conductivities of annealed and as-cast alloys are influenced by the distribution of interdendrite regions which is rich in Cu element.

Keywords

high entropy alloy / annealing / microstructure / mechanical properties / electrical conductivity

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Zhisheng Nong, Jingchuan Zhu, Xiawei Yang, Hailing Yu, Zhonghong Lai. Effects of annealing on microstructure, mechanical and electrical properties of AlCrCuFeMnTi high entropy alloy. Journal of Wuhan University of Technology Materials Science Edition, 2013, 28(6): 1196-1200 DOI:10.1007/s11595-013-0844-9

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