Boundary layer distributions and cooling rate of cooling sloping plate process

Zhanyong Zhao , Renguo Guan , Xiang Wang , Hongqian Huang , Runze Chao , Lei Dong , Chunming Liu

Journal of Wuhan University of Technology Materials Science Edition ›› 2013, Vol. 28 ›› Issue (4) : 701 -705.

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Journal of Wuhan University of Technology Materials Science Edition ›› 2013, Vol. 28 ›› Issue (4) : 701 -705. DOI: 10.1007/s11595-013-0755-9
Advanced Materials

Boundary layer distributions and cooling rate of cooling sloping plate process

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Abstract

According to the principle of grain refining and slurry preparation by cooling sloping plate process, the distributions of boundary layers during melt treatment by cooling sloping plate were studied, and mathematic model of cooling rate was established. The calculation value approximately agrees with the experimental result. Laminar flow and turbulent flow exist on sloping plate surface commonly. The thickness of velocity boundary layer and the critical transfer distance from laminar flow to turbulent flow increase with the decrease of initial flow velocity. The thickness of temperature boundary layer increases with the increment of flow distance and the decrease of initial flow velocity. The melt cooling rate and melt thickness have an inverse proportion relationship. The melt cooling rate increases along the plate direction gradually when the initial flow velocity is lower than 1 m/s, the melt cooling rate keeps nearly a constant when the initial flow velocity is 1 m/s, when the initial flow velocity is higher than 1 m/s, the melt cooling rate decreases gradually. The melt cooling rate of cooling sloping plate process can reach 102–103 K/s and belongs to meta-rapid solidification scope.

Keywords

semisolid / grain refining / sloping plate / temperature boundary layer / cooling rate

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Zhanyong Zhao, Renguo Guan, Xiang Wang, Hongqian Huang, Runze Chao, Lei Dong, Chunming Liu. Boundary layer distributions and cooling rate of cooling sloping plate process. Journal of Wuhan University of Technology Materials Science Edition, 2013, 28(4): 701-705 DOI:10.1007/s11595-013-0755-9

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