High-g impact resistance for epoxy molding compound

Abstract

The behavior of resistance high-g impact of EMC (epoxy molding compound) with two package models, small outline package (POS) and Globtop, was evaluated by experimental method used Hopkinson bar. At 120,000 g (generated in the Hopkinson bar with widths about 70 μ s) no damage in either the POS devices or the Globtop devices was observed. In order to enhance the EMC’s ability of resistance high-g impact, buffering effect of epoxy resin was also studied. The experimental results above all show that EMC has a better performance of impact resistance at about 120,000 g, and epoxy resin can absorb the stress wave to have the protected ability. The study of this paper could serve as a basis for selection packaging materials and enhance its reliability in high-g impact environment.

Keywords

epoxy molding compound (EMC) / reliability / high-g impact / hopkinson bar

References

[1] Xu p., Zu j., Fan jingbiao. The Influence of Stress Wave Propagation on High Acceleration Measurement of Projectile [J]. Journal of Test and Measurement Technology, 2006, 20: 41-45.

[2] Davies B. R., Barron C.C., Montague S., . High G MEMS Integrated Accelerometer[C]. SPIE Proceedings, 1997, 3046: 52-62.

[3] Chu A. Technical Paper No 308, Endevco Corporation (1992) http: //www.endevco.com

[4] Tanner D. M., Walraven J. A., Helgesen K., . MEMS Reliability in Impact Environments. IEEE International Reliability Physics Symposium Proceedings[C]. 2000 IEEE International Reliability Physics Symposium, 2000 San Joes USA Piscataway IEEE 129-138.

[5] Tummala R.R., Rymaszewi E.J. Microelectronics Packaging Handbook[M], 1989 New York Van Nostrand Reihold

[6] Srikar VT, Stephen D. Senturia. The Design and Analysis of Impact Resistant Microsystems (MEMS)[C]//Transdusers’01, Munich, Germany, June 10–14, 2001

[7] Srikar VT, Stephen D. Senturia. the Reliability of Microelectromechanical Systems (MEMS) in Impact Environments[J]. Journal of Microelectromechanical Systems, 2002: 11

[8] Auersperg J., Kieselstein E., Schubert A., Michel B. Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches[J]. J. Electron Packaging, 2002, 124: 31922

[9] Lee K.Y., Lee T.S. Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process[J]. J. Electron Packaging, 1999, 121: 148-55.

[10] Weidong H., Xia C., Bulu X., . Packaging Effects on the Performances of MEMS for High-G Accelerometer with Double-cantilevers[J]. Sensors and Actuators A, 2003, 102: 268-278.

[11] Liu S.L., Chen G., Yong M.S. EMC Characterization and Process Study for Electronics Packaging[J]. Thin Solid Films, 2004, 462–463: 454-458.

[12] Lupinski J.H. Polymer Materials for Electronics Packaging and Interconnection[M], 1989 Washington DC American Chemical Society

[13] Kim W.-G., Lee J.-Y. Curing Characteristics of Epoxy Resin Systems that Include a Biphenyl Moiety[J]. Journal of Applied Polymer Science, 2002, 86: 1942-1952.

[14] Bracke W., Merken P., Puers R., Van Hoof C. Generic Architectures and Design Methods for Autonomous Sensors[J]. Sensors and Actuators, A, 2007, 135: 881-888.

[15] Chandrasekhar A., Brebels S., Stoukatch S., . The Influence of Packaging Materials on RF Performance[J]. Microelectronics Reliability, 2003, 43: 351-357.

[16] Togami T.C., Baker W.E., Forrestal M.J. A Split Hopkinson Bar Technique to Evaluate the Performance of Accelerometers[J]. J. Appl. Mechan, 1996, 63: 353-356.

[17] Davies B.R., Barron C.C., Montague S., . High-G MEMS Integrated Accelerometer[C]. Proc. SPIE, 1997, 3046: 52-62.