Thermal-stress simulation of direct-chill casting of AZ31 magnesium alloy billets

Hongjun Hu , Dingfei Zhang , Fusheng Pan , Mingbo Yang

Journal of Wuhan University of Technology Materials Science Edition ›› 2009, Vol. 24 ›› Issue (3) : 376 -382.

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Journal of Wuhan University of Technology Materials Science Edition ›› 2009, Vol. 24 ›› Issue (3) : 376 -382. DOI: 10.1007/s11595-009-3376-6
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Thermal-stress simulation of direct-chill casting of AZ31 magnesium alloy billets

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Abstract

Two-dimensional (2D) transient coupled finite element model was developed to compute the temperature and stress field in cast billets, so as to predict the defects of the I-type billets made from AZ31 magnesium alloy and find the causes and solutions for surface cracks and shrinkages during direct-chill (DC) casting process. Method of equivalent specific heat was used in the heat conduction equation. The boundary and initial conditions used for primary and secondary cooling were elucidated on the basis of the heat transfer during the solidification of the billet. The temperature and the thermal-stress fields were simulated with the thermal-structural coupled module of ANSYS software. The influences of casting parameters on the distributions of temperature and stress were studied, which helped optimize the parameters (at pouring temperature of 680 °C, casting speed of 2 mm/s, heat-transfer coefficient of the second cooling equals to 5 000 W/m2·°C−1). The simulation results of thermal stress and strain fields reveal the formation mechanism of some casting defects, which is favourable for optimizing the casting parameters and obtain high quality billets. Some measures of controlling processes were taken to prevent the defects for direct-chill casting billets.

Keywords

magnesium alloy / direct-chill casting / temperature and stress fields / numerical simulation / solidification model

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Hongjun Hu, Dingfei Zhang, Fusheng Pan, Mingbo Yang. Thermal-stress simulation of direct-chill casting of AZ31 magnesium alloy billets. Journal of Wuhan University of Technology Materials Science Edition, 2009, 24(3): 376-382 DOI:10.1007/s11595-009-3376-6

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