Preparation and properties of particle reinforced Sn-Zn-based composite solder

Huizhen Huang; Xiuqin Wei; Fuping Liao; Lang Zhou

doi:10.1007/s11595-009-2206-1

Journal of Wuhan University of Technology Materials Science Edition ›› 2009, Vol. 24 ›› Issue (2) : 206 -209. DOI: 10.1007/s11595-009-2206-1

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Preparation and properties of particle reinforced Sn-Zn-based composite solder

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Abstract

Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu₅Zn₈ particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn.

Keywords

lead-free solder / Sn-Zn alloy / Cu powders / composite solder / wettability

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Huizhen Huang, Xiuqin Wei, Fuping Liao, Lang Zhou. Preparation and properties of particle reinforced Sn-Zn-based composite solder. Journal of Wuhan University of Technology Materials Science Edition, 2009, 24(2): 206-209 DOI:10.1007/s11595-009-2206-1

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