Effect of hot deformation on the microstructure of spray-formed 7055 aluminum alloy extruded plate

Xiao-min Lin , Xiao-dong Wu , Ling-fei Cao , Song-bai Tang , Min Bai

Journal of Central South University ›› 2024, Vol. 30 ›› Issue (12) : 3950 -3963.

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Journal of Central South University ›› 2024, Vol. 30 ›› Issue (12) : 3950 -3963. DOI: 10.1007/s11771-023-5507-1
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Effect of hot deformation on the microstructure of spray-formed 7055 aluminum alloy extruded plate

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Abstract

The hot deformation behavior of spray-formed 7055 aluminum alloy extruded plate was studied under conditions of 300–450 °C and 0.01–25 s−1 through a combination of Gleeble hot compression experiments and Deform-3D software simulations. The processing maps, simulation results, and calculation of residual dislocation density and stored energy were used to understand the microstructure evolution of the alloy. The results show that the optimum hot working conditions for the alloy lies within the high-temperature and low-strain rate region (400–450 °C, 0.01–1.0 s−1), where the power dissipation coefficient η is the highest and the damage is the lowest. The unstable domain is concentrated in the high strain rate region (1.0–25 s−1), which has the highest damage and is prone to cracking. Moreover, a slow heating and long duration heat-treatment prior to hot deformation was designed to solve the problem of formation of coarse grains and abnormal grain growth after solution treatment. This heat treatment can effectively reduce the residual dislocation density and stored energy, and promote the precipitation of Al3Zr particles to hinder dislocation movement and pin grain boundaries, thereby inhibiting the static recrystallization during solution treatments.

Keywords

spray-formed 7055 aluminum alloy / hot deformation / Deform-3D software / damage value / coarse-grain

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Xiao-min Lin, Xiao-dong Wu, Ling-fei Cao, Song-bai Tang, Min Bai. Effect of hot deformation on the microstructure of spray-formed 7055 aluminum alloy extruded plate. Journal of Central South University, 2024, 30(12): 3950-3963 DOI:10.1007/s11771-023-5507-1

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