Optimizing microstructure and mechanical properties of heat-treated Al-Zn-Mg-Cu alloy by indirect hot deformation technology

Quan-da Zhang , Fu-zhen Sun , Meng Liu , Wen-cai Liu

Journal of Central South University ›› 2022, Vol. 29 ›› Issue (11) : 3544 -3556.

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Journal of Central South University ›› 2022, Vol. 29 ›› Issue (11) : 3544 -3556. DOI: 10.1007/s11771-022-4968-y
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Optimizing microstructure and mechanical properties of heat-treated Al-Zn-Mg-Cu alloy by indirect hot deformation technology

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Abstract

In this paper, the indirect thermal tensile experiments of 7075 aluminum alloy including the pre-deformation process at room temperature and the final heat tensile process were carried out, the plastic deformation behavior and forming limit of the material in the compound forming process were investigated considering three pre-deformation amounts 4%, 9%, 14%, two strain rates 0.001 s−1, 0.01 s−1 and four forming temperatures 300 °C, 350 °C, 400 °C, 450 °C. In the indirect hot forming process, the material is sensitive to the pre-deformation, strain rate, and forming temperature, when the strain rate is 0.01 s−1, the pre-deformation amount is 4%, and the forming temperature is 400 °C, respectively, the maximum tensile deformation is 50 mm. Finally, taking the process in which the forming temperature is 450 °C as an example, according to the observation of the microstructure appearance of fracture, the fracture type in the hot forming process was judged as the ductile fracture. By analyzing the microstructure of the specimen treated with the quenching and artificial aging process, the eutectic T (AlZnMgCu) phase and α(Al) matrix formed a network of non-equilibrium alpha binary eutectic.

Keywords

strain rate / pre-deformation / forming temperature / AA7075 / compound tensile

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Quan-da Zhang, Fu-zhen Sun, Meng Liu, Wen-cai Liu. Optimizing microstructure and mechanical properties of heat-treated Al-Zn-Mg-Cu alloy by indirect hot deformation technology. Journal of Central South University, 2022, 29(11): 3544-3556 DOI:10.1007/s11771-022-4968-y

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