Heat transfer performance testing of a new type of phase change heat sink for high power light emitting diode

Abstract

In view of the limitations of solid metal heat sink in the heat dissipation of high power light emitting diode (LED), a kind of miniaturized phase change heat sink is developed for high power LED packaging. First, the fabrication process of miniaturized phase change heat sink is investigated, upon which all parts of the heat sink are fabricated including main-body and end-cover of the heat sink, the formation of three-dimensional boiling structures at the evaporation end, the sintering of the wick, and the encapsulation of high power LED phase change heat sink. Subsequently, with the assistance of the developed testing system, heat transfer performance of the heat sink is tested under the condition of natural convection, upon which the influence of thermal load and working medium on the heat transfer performance is investigated. Finally, the heat transfer performance of the developed miniaturized phase change heat sink is compared with that of metal solid heat sink. Results show that the developed miniaturized phase change heat sink presents much better heat transfer performance over traditional metal solid heat sink, and is suitable for the packaging of high power LED.

Keywords

miniaturized phase change heat sink / three-dimensional microgrooves / sintered wick / heat transfer performance testing

References

[1] NarendranN, GuY, FreyssinierJ P, YuH, DengL. Solid-state lighting: Failure analysis of white LEDs [J]. Journal of Crystal Growth, 2004, 268(34): 449-456

[2] LuoX, HuR, LiuS, WangKai. Heat and fluid flow in high-power LED packaging and applications [J]. Progress in Energy and Combustion Science, 2016, 56: 1-32

[3] ZhaoT, ChenR. Recent progress in understanding of coupled heat/mass transport and electrochemical reactions in fuel cells [J]. International Journal of Energy Research, 2011, 35(1): 15-23

[4] FengM, WangE, WangH, LiY, LiuBing. Numerical simulation on boiling heat transfer of evaporation cooling in a billet reheating furnace [J]. Journal of Central South University, 2016, 23(6): 1515-1524

[5] FsadniA M, WhittyJ P M. A review on the two-phase heat transfer characteristics in helically coiled tube heat exchangers [J]. International Journal of Heat & Mass Transfer, 2016, 95: 551-565

[6] DengD, WanW, ShaoH, TangY, FengJ, ZengJian. Effects of operation parameters on flow boiling characteristics of heat sink cooling systems with reentrant porous microchannels [J]. Energy Conversion and Management, 2015, 96: 340-351

[7] HosseinG, MoslemN. Thermo-structural analysis on evaluating effects of friction and transient heat transfer on performance of gears in high-precision assemblies [J]. Journal of Central South University, 2017, 24(1): 71-80

[8] KangL, ZhaoG, TianN, ZhangHai. Computation of synthetic surface heat transfer coefficient of 7B50 ultra-high-strength aluminum alloy during spray quenching [J]. Transactions of Nonferrous Metals Society of China, 2018, 28(5): 989-997

[9] ArshadW, AliH M. Graphene nanoplatelets nanofluids thermal and hydrodynamic performance on integral fin heat sink [J]. International Journal of Heat and Mass Transfer, 2017, 107: 995-1001

[10] XiangJ, ZhangC, JiangF, LiuX, TangYong. Fabrication and testing of phase change heat sink for high power LED [J]. Transactions of Nonferrous Metals Society of China, 2011, 21(9): 2066-2071

[11] XiangJ, DuanJ, ZhouH, ZhangC, LiuG, ZhouChao. Forming mechanism of three-dimensional integral fin based on flat surface [J]. Journal of Central South University, 2015, 22(5): 1660-1666

[12] AliH M, ArshadW. Effect of channel angle of pin-fin heat sink on heat transfer performance using water based graphene nanoplatelets nanofluids [J]. International Journal of Heat & Mass Transfer, 2016, 106: 465-472

[13] ArshadW, AliH M. Experimental investigation of heat transfer and pressure drop in a straight minichannel heat sink using TiO₂ nanofluid [J]. International Journal of Heat & Mass Transfer, 2017, 248: 248-256

[14] YangK S, ChungC H, LeeM T, ChiangS B, WongC H, WangC C. An experimental study on the heat dissipation of LED lighting module using metal/carbon foam [J]. International Communications in Heat & Mass Transfer, 2013, 48(11): 73-79

[15] HaM, GrahamS. Development of a thermal resistance model for chip-on-board packaging of high power LED arrays [J]. Microelectronics Reliability, 2012, 52(5): 836-844

[16] XiaoC, LiaoH, WangY, LiJ, ZhuWen. A novel automated heat-pipe cooling device for high-power LEDs [J]. Applied Thermal Engineering, 2017, 111: 1320-1329

[17] ZhaoX, CaiY, WangJ, LiX, ZhangChun. Thermal model design and analysis of the high-power LED automotive headlight cooling device [J]. Applied Thermal Engineering, 2015, 75: 248-258