Partial transient-liquid-phase bonding of TiC cermet to stainless steel using impulse pressuring with Ti/Cu/Nb interlayer

Abstract

Partial transient liquid phase (PTLP) bonding of TiC cermet to 06Cr19Ni10 stainless steel was carried out. Impulse pressuring was used to reduce the bonding time, and a Ti/Cu/Nb interlayer was employed to alleviate the detrimental effect of interfacial reaction products on the bonding strength. Successful bonding was achieved at 885 °C under a pulsed pressure of 2–10 MPa within durations in the range of 2–8 min, which was notably shortened in comparison with conventional PTLP bonding. Microstructure characterization revealed the σ phase with a limit solubility of Nb, a sequence of Ti—Cu intermetallic phases and solid solutions of Ni and Cu in α+β Ti in the reaction zone. The maximum shear strength of 106.7 MPa was obtained when the joint was bonded for 5 min, indicating that a robust metallurgical bonding was achieved. Upon shear loading, the joints fractured along the Ti—Cu intermetallics interface and spread to the interior of TiC cermet in a brittle cleavage manner.

Keywords

TiC cermet / transient liquid phase / impulse pressuring / mechanical property / fracture

References

[1] LiuN, XuY D, LiH. Effect of nano-micro TiN addition on the microstructure and mechanical properties of TiC based cermets [J]. J Eur Ceram Soc, 2002, 22(13): 2409-2414

[2] SunK N, YinY S, LiA MIntermetallics/ceramic matrix composite [M], 2002, Beijing, China Machine Press

[3] TravessaD, FerranteM, DenO G. Diffusion bonding of aluminium oxide to stainless steel using stress relief interlayers [J]. Mater Sci Eng A, 2002, 337(1): 287-296

[4] ShenX Q, LiY J, PutchkovU A. Finite-element analysis of residual stresses in Al₂O₃–TiC/W₁₈Cr₄V diffusion bonded joints [J]. Comp Mater Sci, 2009, 45(2): 407-410

[5] YeD M, XiongW H. Vacuum brazing of Ti(C, N) based cermets to 45 Steel [J]. Rare Metal Mat Eng, 2008, 37(7): 1281-1284

[6] PiersonH OHandbook of refractory carbides & nitrides: Properties, characteristics, processing and apps [M], 1996

[7] Gomez-De-SalazarJ M, BarrenaM I. Dissimilar fusion welding of AA7020/MMC reinforced with Al₂O₃ particles, microstructure and mechanical properties [J]. Mater Sci Eng A, 2003, 352(1): 162-168

[8] BarrenaM I, Gomez-De-SalazarJ M, MatesanzL. Ni–Cu alloy for diffusion bonding cermet/steel in air [J]. Mater Lett, 2009, 63(24): 2142-2145

[9] LiZ R, FengJ C, CaoJ. Vacuum diffusion bonding of TiB₂ cermet to TiAl based alloys [J]. Mater Sci Tech-Lond, 2004, 20(12): 1666-1668

[10] HuangW Q, LiY, WangJ. Microstructure and fracture of TiC-Al₂O₃/W₁₈Cr₄V diffusion bonded joint [J]. Kovove Mater, 2010, 48: 227-231

[11] ChenZ, CaoM S, ZhaoQ Z. Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer [J]. Mater Sci Eng A, 2004, 380(1): 394-401

[12] ZhengC, LouH, FeiZ. Partial transient liquid-phase bonding of Si₃N₄ with Ti/Cu/Ni multi-interlayers [J]. J Mater Sci Lett, 1997, 16(24): 2026-2028

[13] WangG, LannuttiJ J. Chemical thermodynamics as a predictive tool in the reactive metal brazing of ceramics [J]. Metall Mater Trans A, 1995, 26(6): 1499-1505

[14] MassalskiT B, OkamotoH, SubramanianP RBinary alloy phase diagrams [M], 1990, Materials Park, OH, ASM International

[15] YangM, ZouZ D, SongS L. Effect of interlayer thickness on strength and fracture of Si3N4 and Inconel600 joint [J]. Key Eng Mater, 2005, 297: 2435-2440

[16] MarksR A, SugarJ D, GlaeserA M. Ceramic joining IV. Effects of processing conditions on the properties of alumina joined via Cu/Nb/Cu interlayers [J]. J Mater Sci, 2001, 36(23): 5609-5624

[17] ShackelfordJ F, AlexanderWCRC materials science and engineering handbook [M], 2010

[18] HanJ, ShengG M, ZhouX L. Pulse pressuring diffusion bonding of Ti alloy/austenite stainless steel processed by surface self-nanocrystallization [J]. ISIJ Int, 2009, 49(1): 86-91

[19] SunX J, GuJ L, BaiB Z, ChenN P. Fabrication of submicron grained titanium alloy by compressive deformation [J]. Acta Metall Sin-Engl, 2009, 13(2): 638-644

[20] LiuG M, ZouG S, WuA P. Improvements of the Si₃N₄ brazed joints with intermetallics [J]. Mater Sci Eng A, 2006, 415(1): 213-218

[21] XuH, DuY, HuangB. Phase equilibria of the Cu–Nb–Ti system at 850 °C [J]. J Alloy Compd, 2005, 399(1): 92-95

[22] KunduS, ChatterjeeS. Characterization of diffusion bonded joint between titanium and 304 stainless steel using a Ni interlayer [J]. Mater Charact, 2008, 59(5): 631-637

[23] ZdaniewskiW A, ConwayJ C, KirchnerH P. Effect of joint thickness and residual stresses on the properties of ceramic adhesive joints: II, Experimental results [J]. J Am Ceram Soc, 1987, 70(2): 110-118

[24] BluganG, KueblerJ, BissigV. Brazing of silicon nitride ceramic composite to steel using SiC-particlereinforced active brazing alloy [J]. Ceram Int, 2007, 33(6): 1033-1039

[25] SinghM, MartinezF J, AsthanaR. Interfacial characterization of silicon nitride/silicon nitride joints brazed using Cu-base active metal interlayers [J]. Ceram Int, 2012, 38(4): 2793-2802