Microstructural developments and precipitate transformation during transient liquid-phase bonding of a duplex stainless steel

Abstract

Effect of holding time on microstructural developments and transformation of precipitates formed at the interface during transient liquid-phase bonding of a duplex stainless steel using a Ni-based amorphous insert alloy was studied. The experimental results reveal that the microstructure of the adjacent base metal varies clearly as a function of holding time. The migration of Cr and Ni elements and the δ→γ transformation seem to play relevant roles in this microstructure evolution. The scanning electron microscopy (SEM) and electron prob X-ray microanalysis (EPMA) results indicate the transformation of BN→BN and (N, Mo) boride→BN at the interface with the holding time of 60–1 800 s. N content changes with holding time increasing at locations at the interface might be a controlling factor contributing to this transformation.

Keywords

transient liquid-phase bonding / duplex stainless steel / microstructural development / precipitate transformation

References

[1] HumpstonG., JacobsonD. M.Principles of soldering and brazing [M], 1993Materials Park, OhioASM International128-132

[2] MosallaeeM., EkramiA., OhsasaK., MatsuuraK.. Microstructural evolution in the transient-liquid-phase bonding area of IN-738LC/BNi-3/IN-738LC [J]. Metallurgical and Materials Transactions A, 2008, 39(10): 2389-2402

[3] TokoroK., WikstromN. P., OjoO. A., ChaturvediM. C.. Variation in diffusion-induced solidification rate of liquated Ni-Cr-B insert during TLP bonding of Waspaloy superalloy [J]. Materials Science and Engineering A, 2008, 477(1/2): 311-318

[4] PouranvariM., EkramiA., KokabiA. H.. Effect of bonding temperature on microstructure development during TLP bonding of a nickel base superalloy [J]. Journal of Alloys and Compounds, 2009, 469(1/2): 270-275

[5] GhoneimA., OjoO. A.. Microstructure and mechanical response of transient liquid phase joint in Haynes 282 superalloy [J]. Materials Characterization, 2011, 62(1): 1-7

[6] PouranvariM., EkramiA., KokabiA. H.. Microstructure-properties relationship of TLP-bonded GTD-111 nickel-base superalloy [J]. Materials Science and Engineering A, 2008, 490(1/2): 229-234

[7] AlhazaaA., KhanT. I., HaqI.. Transient liquid phase (TLP) bonding of Al7075 to Ti-6Al-4V alloy [J]. Materials Characterization, 2010, 61(3): 312-317

[8] LiH.-x., HeP., LinT.-s., PanF., FengJ.-c., HuangY.-dong.. Microstructure and shear strength of reactive brazing joints of TiAl/Ni-based alloy [J]. Transactions of Nonferrous Metals Society of China, 2012, 22(2): 324-329

[9] ChenS. J., TangH. J., JingX. T.. Transient liquid-phase bonding of T91 steel pipes using amorphous foil [J]. Materials Science and Engineering A, 2009, 499(1/2): 114-117

[10] ChiuL. H., HsiehW. C., WuC. H.. Cooling rate effect on vacuum brazed joint properties for 2205 duplex stainless steels [J]. Materials Science and Engineering A, 2003, 354(1/2): 82-91

[11] KhanT. I., KabirM. J., BulpettR.. Effect of transient liquid-phase bonding variables on the properties of a micro-duplex stainless steel [J]. Materials Science and Engineering A, 2004, 372(1/2): 290-295

[12] YuanX., KangC. Y., KimM. B.. Microstructure and XRD analysis of brazing joint for duplex stainless steel using a Ni-Si-B filler metal [J]. Materials Characterization, 2009, 60(9): 923-931

[13] YuanX., KimM. B., KangC. Y.. Microstructural evolution and bonding behavior during transient liquid-phase bonding of a duplex stainless steel using two different Ni-B-based filler materials [J]. Metallurgical and Materials Transactions A, 2011, 42(5): 1310-1324

[14] Japan Metal Society.Metal Data Book [M], 1984TokyoMaruzen92

[15] The japan institute of metals. metals data book [M]. Tokyo: Maruzen, 1993: 21–22.

[16] DevineT. M., DrummondB. J.. Use of accelerated intergranular corrosion tests and pitting corrosion tests to detect sensitization and susceptibility to intergranular stress corrosion cracking in high-temperature [J]. Corrosion, 1981, 37(2): 104-115