Thermal analysis of an innovative flat heat pipe radiator

Abstract

An innovative flat heat pipe radiator was put forward, and it has the features of high efficiency of heat dissipation, compact construction, low thermal resistance, light weight, low cost, and anti-dust-deposition. The thermal analysis of the flat heat pipe radiator for cooling high-power light emitting diode (LED) array was conducted. The thermal characteristics of the flat heat pipe radiator under the different heat loads and incline angles were investigated experimentally in natural convection. An electro-thermal conversion method was used to measure the junction temperature of the LED chips. It is found that the integral temperature distribution of the flat heat pipe radiator is reasonable and uniform. The total thermal resistance of the flat heat pipe radiator varies in the range of 0.38–0.45 K/W. The junction temperatures of LED chips with the flat heat pipe radiator and with the aluminum board at the same forward current of 0.35 A are 52.5 and 75.2 °C, respectively.

Keywords

energy technology / thermal analysis / flat heat pipe radiator / thermal characteristics

References

[1] HWU F S, SHEU G J, CHEN J C. Thermal modeling and performance of LED packaging for illuminating device [C]// 6th SPIE Inter Conf on Solid State Lighting. San Diego, USA, 2006: J1–J6.

[2] ACIKALIN T, GARIMELLA S V, PETROSKI J, RAMAN A. Optimal design of miniature piezoelectric fans for cooling light emitting diodes [C]// 9th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. New York, USA, 2004: 663–671.

[3] MA H K, CHEN B R, LAN H W, LIN K T, CHAO C Y. Study of an LED device with vibrating piezoelectric fins [C]// 25th IEEE SEMI-THERM Symposium. CA, USA, 2009: 267–272.

[4] CHAU S W, LIN C H, YEH C H, YANG C. Study on the cooling enhancement of LED heat sources via an electrohydrodynamic approach [C]// 33rd Annual Conference of the IEEE Industrial Electronics Society. Taipei, 2007: 2934–2937

[5] MA Ze-tao, WANG Xiao-jun, ZHU Da-qing, LIU Sheng. Thermal analysis and modeling of LED arrays integrated with an innovative liquid-cooling module [C]// 6th IEEE Inter Conf on Electronic Packaging Technology. Shenzhen, China, 2005: 1–4.

[6] LUO Xiao-bing, LIU Sheng. A microjet array cooling system for thermal management of high-brightness LEDs [C]// IEEE Transactions on Advanced Packaging. New York, USA, 2007: 475–484.

[7] ChengJ. H., LiuC. K., ChaoY. L., TainR. M.. Cooling performance of silicon-based thermoelectric device on high power LED [C]. 24th IEEE International Conference on Thermoelectrics, 2005, USA, University of Clemson: 53-56

[8] LIU C K, DAI M J, YU C K, KUO S L. High efficiency silicon-based high power LED package integrated with micro-thermoelectric device [C]// IEEE International Microsystems, Packaging, Assembly and Circuits Technology Conference. 2007: 29–33.

[9] SHEU G J, HWU F S, TU S H, CHEN W T, CHANG J Y, CHEN J C. The heat dissipation performance of LED applied a MHP [C]// 5th SPIE International Conference on Solid State Lighting. San Diego, USA, 2005: 1–8.

[10] KimL., ChoiJ. H., JangS. H., ShinM. W.. Thermal analysis of LED array system with heat pipe [J]. Thermochimica Acta, 2007, 455: 21-25

[11] LIN S C, HONG J T, TSAI M L, SHIH H C, LEONG J C, CHEN W L. Thermal management of the LED headlamp module for a motorcycle [C]// 40th AIAA Thermophysics Conference. Washington, USA, 2008: 4252.

[12] LuX.-y., HuaT.-C., LiuM.-j., ChengY.-xia.. Thermal analysis of loop heat pipe used for high power LED [J]. Thermochimica Acta, 2009, 493: 25-29

[13] ARIK M, WEAVER S. Chip scale thermal management of high brightness LED packages [C]// 5th SPIE Inter Conf on Solid State Lighting. Denver, USA, 2004: 214–223.

[14] SHIN M W. Thermal design of high-power LED package and system [C]// SPIE Advanced LEDs for Solid State Lighting. Gwangju, South Korea, 2006: 635509.