Curing mechanism of TDE-85/MeTHPA epoxy resin modified by polyurethane

Zhi-hua Li , Zi-qiao Zheng , Dong-yan Ren , Yao-peng Huang

Journal of Central South University ›› 2007, Vol. 14 ›› Issue (3) : 296 -300.

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Journal of Central South University ›› 2007, Vol. 14 ›› Issue (3) : 296 -300. DOI: 10.1007/s11771-007-0058-4
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Curing mechanism of TDE-85/MeTHPA epoxy resin modified by polyurethane

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Abstract

Diglycidyl 4,5-epoxy tetrahydro phthalate/methyl tetrahydrophthalic anhydride (TDE-85/MeTHPA) epoxy resin modified by polyurethane (PU) was prepared with 1,4-butanediol (1,4-BDO), trimethylol propane (TMP) and polyurethane prepolymer synthesized by polypropylene glycol and toluene diisocynate. Chemical reaction and curing mechanism of this system were discussed by incorporating the results of infra spectrum analysis. The results indicate that the epoxy polymeric network I is obtained by the curing reaction between TDE-85 and MeTHPA, while the PU polymeric network II is obtained by the chain-extended and crosslinking reaction between 1,4-BDO, TMP and polyurethane prepolymer(PUP). The graft chemical bonds are formed between polymer networks I and II that therefore increase the degree of blend and compatibility between epoxy polymer and PU.

Keywords

polyurethane / epoxy resin / modification / curing mechanism

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Zhi-hua Li, Zi-qiao Zheng, Dong-yan Ren, Yao-peng Huang. Curing mechanism of TDE-85/MeTHPA epoxy resin modified by polyurethane. Journal of Central South University, 2007, 14(3): 296-300 DOI:10.1007/s11771-007-0058-4

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