Characteristics of ultrasonic vibration transmission in bonding process
Jun-hui Li , Si-zong Min , Lei Han , Jue Zhong
Journal of Central South University ›› 2005, Vol. 12 ›› Issue (5) : 567 -571.
Characteristics of ultrasonic vibration transmission in bonding process
The transmitting models of ultrasonic vibration in ultrasonic transducer and capillary were presented according to the propagating mechanism of ultrasonic wave in elastic body. The coupling characteristics of ultrasonic longitudinal-complex transverse vibration system were simulated by Matlab software. The ultrasonic vibration displacement and the velocity of high frequency were measured by using the PSV-400-M2 (1.5 MHz) laser Doppler vibrometer. The vibration locus shapes driven by the same frequency and different frequencies were tested by using GDS-820S dual channel digital oscilloscope. The microstructures at bonding interface were observed by means of KYKY2800 scanning electron microscope. The results show that ultrasonic vibration displacement or velocity and energy density increase with the decrease of section area in the transmitting process. The vibration locus shapes driven simultaneously by the same frequency and different frequencies are elliptical (or circular) loci and rectangular (or square) loci, respectively. And the characteristics at bonding interface are improved by coupling loci.
ultrasonic bonding / coupling vibration / transducer / ultrasonic longitudinal-complex transverse system
| [1] |
|
| [2] |
|
| [3] |
|
| [4] |
|
| [5] |
LIAO Hua-li, LIU Ren-xiao. The study of the performance of vibration energy transmission in the ultrasonic amplitude transformer[J]. Machinery Design and Manufacture, 1999(5): 71–72. (in Chinese) |
| [6] |
|
| [7] |
|
| [8] |
|
| [9] |
|
| [10] |
|
| [11] |
|
| [12] |
|
| [13] |
|
| [14] |
|
| [15] |
|
| [16] |
|
| [17] |
LI Jun-hui, TAN Jian-ping, HAN Lei, et al. Studies on microstructure characteristics and evolutions at the bond interface in bonding technology[A]. IEEE Proceeding of HDP[C]. Shanghai, 2004. |
| [18] |
LI Jun-hui, HAN Lei, ZHONG Jue. Atomic diffusion at the thermosonic bond interface in aluminum and gold and aluminum and nickel[A]. The 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis(HDP05)[C]. Shanghai, 2005. |
| [19] |
LI Jun-hui, HAN Lei, ZHONG Jue. Features of bonded interface and PZT transducer[A]. The 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis(HDP05) [C]. Shanghai, 2005. |
| [20] |
|
/
| 〈 |
|
〉 |