Electrodeposition of copper by IMPC method

Kang-gen Zhou , Qing-gang Li , Qi-xiu Zhang

Journal of Central South University ›› 2000, Vol. 7 ›› Issue (4) : 186 -190.

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Journal of Central South University ›› 2000, Vol. 7 ›› Issue (4) : 186 -190. DOI: 10.1007/s11771-000-0050-8
Metallurgical Separation Science And Engineering

Electrodeposition of copper by IMPC method

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Abstract

In order to develop an energy-saving electrodeposition process of copper, the electrodeposition of copper in copper sulfate solution by the ion-exchange membrane primary cell (IMPC) method has been studied. The experiments were carried out in an ion-exchange membrane primary cell with dimensions of 200 mm in length, 52 mm in width and 90 mm in height. The influences of temperature (294–323 K), interval between the anode and cathode (1.5–3.5 cm), mass concentrations of Cu2+ (6–40 g/L), H2SO4 (0–120 g/L) and Fe3+ (3–9 g/L) in catholyte and solution flow rate (0–8 cm/s) on current density and current efficiency were investigated experimentally. The current density increases with the increase of temperature and concentrations of Cu2+ and H2SO4 in catholyte. Cathode current efficiency decreases with the increase of concentration of Fe3+ in catholyte and anode current efficiency decreases with the increase of temperature. The high-quality cathodic copper can be obtained and the current density of membrane can be higher than 150 A/m2 and the current density of cathode can be higher than 300 A/m2. The experiment results show that IMPC method is effective for electrodeposition of copper.

Keywords

ion-exchange membrane / primary cell / copper / electrodeposition

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Kang-gen Zhou, Qing-gang Li, Qi-xiu Zhang. Electrodeposition of copper by IMPC method. Journal of Central South University, 2000, 7(4): 186-190 DOI:10.1007/s11771-000-0050-8

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