Impact toughness, crack initiation and propagation mechanism of Ti6422 alloy with multi-level lamellar microstructure
Jie Shen , Zhihao Zhang , Jianxin Xie
International Journal of Minerals, Metallurgy, and Materials ›› 2026, Vol. 33 ›› Issue (2) : 595 -609.
Impact toughness, crack initiation and propagation mechanism of Ti6422 alloy with multi-level lamellar microstructure
The influence of different solution and aging conditions on the microstructure, impact toughness, and crack initiation and propagation mechanisms of the novel α + β titanium alloy Ti6422 was systematically investigated. By adjusting the furnace cooling time after solution treatment and the aging temperature, Ti6422 alloy samples were developed with a multi-level lamellar microstructure, including microscale α colonies and αp lamellae, as well as nanoscale αs phases. Extending the furnace cooling time after solution treatment at 920°C for 1 h from 240 to 540 min, followed by aging at 600°C for 6 h, increased the αp lamella content, reduced the αs phase content, expanded the α colonies and αp lamellae size, and improved the impact toughness from 22.7 to 53.8 J/cm2. Additionally, under the same solution treatment, raising the aging temperature from 500 to 700°C resulted in a decrease in the αs phase content and a growth in the thickness of the αp lamella and αs phase. The impact toughness increased significantly with these changes. Samples with high αp lamellae content or large αs phase size exhibited high crack initiation and propagation energies. Impact deformation caused severe kinking of the αp lamellae in crack initiation and propagation areas, leading to a uniform and high-density kernel average misorientation (KAM) distribution, enhancing plastic deformation coordination and uniformity. Moreover, the multidirectional arrangement of coarser α colonies and αp lamellae continuously deflect the crack propagation direction, inhibiting crack propagation.
novel titanium alloy / multi-level lamellar microstructure / impact toughness / crack initiation and propagation
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University of Science and Technology Beijing
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