Advances in micro/nanoparticle-enhanced Sn-based composite solders

Abstract

Sn-based solder is a widely used interconnection material in the field of electronic packaging; however, the performance requirements for these solders are becoming increasingly demanding owing to the rapid development in this area. In recent years, the addition of micro/nanoreinforcement phases to Sn-based solders has provided a solution to improve the intrinsic properties of the solders. This paper reviews the progress in Sn-based micro/nanoreinforced composite solders over the past decade. The types of reinforcement particles, preparation methods of the composite solders, and strengthening effects on the microstructure, wettability, melting point, mechanical properties, and corrosion resistance under different particle-addition levels are discussed and summarized. The mechanisms of performance enhancement are summarized based on material-strengthening effects such as grain refinement and second-phase dispersion strengthening. In addition, we discuss the current shortcomings of such composite solders and possible future improvements, thereby establishing a theoretical foundation for the future development of Sn-based solders.

Keywords

Sn-based composite solder / micro/nanoparticles / properties / electronic packaging / microstructure / corrosion resistance

References

[1] X.Y. Hao, Z.C. Xu, C.M. Gourlay, and Q.Q. Li, Grain refinement of magnesium castings using recycled machining chips, Mater. Des., 244(2024), art. No. 113138.

[2] J.W. Xian, Y.L. Xu, S. Stoyanov, R.J. Coyle, F.E. Dunne, and C.M. Gourlay, The role of microstructure in the thermal fatigue of solder joints, Nat. Commun., 15(2024), No. 1, art. No. 4258.

[3] Y. Cui, J.W. Xian, A. Zois, K. Marquardt, H. Yasuda, and C.M. Gourlay, Nucleation and growth of Ag₃Sn in Sn–Ag and Sn–Ag–Cu solder alloys, Acta Mater., 249(2023), art. No. 118831.

[4] Liu JH, Zhu Z, Nie QQ, Liu JF, He P, Zhang SY. Characterization and degradation of β-Sn particles in thermal aged Pb-rich solder joint for low-temperature co-fired ceramic (LTCC) applications. Rare Met., 2024, 43(105346

[5] Teja MBK, Sharma A, Das S, Das K. A review on nanodispersed lead-free solders in electronics: Synthesis, microstructure and intermetallic growth characteristics. J. Mater. Sci., 2022, 57(198597

[6] A. Luktuke, A.S.S. Singaravelu, A. Mannodi-Kanakkithodi, and N. Chawla, Influence of Indium addition on microstructural and mechanical behavior of Sn solder alloys: Experiments and first principles calculations, Acta Mater., 249(2023), art. No. 118853.

[7] Liashenko OY, Lay S, Hodaj F. On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface. Acta Mater., 2016, 117: 216

[8] Huang ML, Zhao JF, Zhang ZJ, Zhao N. Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn–3.0Ag–0.5Cu flip chip bumps undergoing electromigration. Acta Mater., 2015, 100: 98

[9] Zhang ZH, Li MY, Liu ZQ, Yang SH. Growth characteristics and formation mechanisms of Cu₆Sn₅ phase at the liquid-Sn_0.7Cu/(111)_Cu and liquid-Sn_0.7Cu/(001)_Cu joint interfaces. Acta Mater., 2016, 104: 1

[10] Dele-Afolabi TT, Ansari MNM, Hanim MAA, Oyekanmi AA, Ojo-Kupoluyi OJ, Atiqah A. Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies. J. Mater. Res. Technol., 2023, 25: 4231

[11] Chen C, Hsiao HY, Chang YW, Ouyang FY, Tu KN. Thermomigration in solder joints. Mater. Sci. Eng. R: Rep., 2012, 73(9–1085

[12] Sun ML, Dong MY, Wang DF, Ling HQ, Hu AM, Li M. Growth behavior of tin whisker on SnAg microbump under compressive stress. Scripta Mater., 2018, 147: 114

[13] Huang YB, Xu N, Lu HL, Ren Y, Li SL, Wang YD. Microstructures and micromechanical behaviors of high-entropy alloys investigated by synchrotron X-ray and neutron diffraction techniques: A review. Int. J. Miner. Metall. Mater., 2024, 31(61333

[14] Huang ML, Zhang ZJ, Zhao N, Zhou Q. A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn–9Zn/Cu interconnect during liquid-solid electromigration. Scripta Mater., 2013, 68(11853

[15] Zamani P, Valefi Z. Comparative investigation of microstructure and high-temperature oxidation resistance of high-velocity oxy-fuel sprayed CoNiCrAlY/nano-Al₂O₃ composite coatings using satellited powders. Int. J. Miner. Metall. Mater., 2023, 30(91779

[16] Li TT, Yang J. Development in oxide metallurgy for improving the weldability of high-strength low-alloy steel: Combined deoxidizers and microalloying elements. Int. J. Miner. Metall. Mater., 2024, 31(61263

[17] Yi ZL, Shan JG, Zhao Y, Zhang ZL, Wu AP. Recent research progress in the mechanism and suppression of fusion welding-induced liquation cracking of nickel based superalloys. Int. J. Miner. Metall. Mater., 2024, 31(51072

[18] Zhang L, Tu KN. Structure and properties of lead-free solders bearing micro and nano particles. Mater. Sci. Eng. R, 2014, 82: 1

[19] M.L. Li, L. Zhang, N. Jiang, L. Zhang, and S.J. Zhong, Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review, Mater. Des., 197(2021), art. No. 109224.

[20] Qiao YY, Hao TK, Lai YQ, Liang HW, Zhao N. Combined effect of Ag element and temperature gradient on the formation of highly orientated Sn grains in micro solder joints. J. Mater. Res. Technol., 2024, 31: 2994

[21] Zhu R, Yang YG, Zhang BZ, et al.. Improving mechanical properties and high-temperature oxidation of press hardened steel by adding Cr and Si. Int. J. Miner. Metall. Mater., 2024, 31(81865

[22] Wu SH, Yang C, Zhang P, et al.. Review of Sc microalloying effects in Al–Cu alloys. Int. J. Miner. Metall. Mater., 2024, 31(51098

[23] Wang SZ, Gao ZJ, Wu GL, Mao XP. Titanium microalloying of steel: A review of its effects on processing, microstructure and mechanical properties. Int. J. Miner. Metall. Mater., 2022, 29(4645

[24] Nyahuma FM, Zhang LT, Song MC, et al.. Significantly improved hydrogen storage behaviors in MgH₂ with Nb nanocatalyst. Int. J. Miner. Metall. Mater., 2022, 29(91788

[25] Zhang L, Han JG, Guo YH, Sun L. Creep behavior of SnAgCu solders containing nano-Al particles. J. Mater. Sci.: Mater. Electron., 2015, 26(63615

[26] Zhang L, Fan XY, Guo YH, He CW. Microstructures and fatigue life of SnAgCu solder joints bearing nano-Al particles in QFP devices. Electron. Mater. Lett., 2014, 10(3645

[27] Sun L, Chen MH, Wei CC, Zhang L, Yang F. Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints. J. Mater. Sci.: Mater. Electron., 2018, 29(129757

[28] Zhang H, Liu Y, Sun FL, Ban GF, Fan JJ. Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes. Microelectron. Int., 2017, 34(140

[29] Shen L, Tan ZY, Chen Z. Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers. Mater. Sci. Eng. A, 2013, 561: 232

[30] Jung KH, Min KD, Lee CJ, Jung SB. Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn–58Bi particles assisted by polyvinylpyrrolidone dispersant. J. Alloy. Compd., 2019, 781: 657

[31] Liu Y, Zhang H, Sun FL. Solderability of SnBi–nano Cu solder pastes and microstructure of the solder joints. J. Mater. Sci.: Mater. Electron., 2016, 27(32235

[32] Sujan GK, Haseeb ASMA, Afifi ABM. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate. Mater. Charact., 2014, 97: 199

[33] Jiang N, Zhang L, Liu ZQ, et al.. Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder. J. Mater. Sci.: Mater. Electron., 2019, 30(1917583

[34] Zhang L, Long WM, He P, Guo YH, Sun L, Jiang N. Effect of Ti nanoparticles on the microstructure and properties of Sn interconnect materials for 3D packaging. Rare Met. Mater. Eng., 2020, 49(124336

[35] Shin JW, Kim I, Choi YW, et al.. Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 µm pitch Cu-pillar/Sn–Ag bump interconnection. Microelectron. Reliab., 2015, 55(2432

[36] Haseeb ASMA, Leong YM, Arafat MM. In-situ alloying of Sn–3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers. Intermetallics, 2014, 54: 86

[37] Chan YH, Arafat MM, Haseeb ASMA. Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn–3.8Ag–0.7Cu solder and copper substrate. Solder. Surf. Mo. Technol., 2013, 25(291

[38] M.N. Bashir, A.F. Khan, S. Bashir, et al., Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint, J. Mater. Sci.: Mater. Electron., 34(2023), No. 5, art. No. 351.

[39] Shafiq I, Chan YC, Wong NB, Yung WKC. Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy. J. Mater. Sci.: Mater. Electron., 2012, 23(71427

[40] Li XZ, Ma Y, Zhou W, Wu P. Effects of nanoscale Cu₆Sn₅ particles addition on microstructure and properties of SnBi solder alloys. Mater. Sci. Eng. A, 2017, 684: 328

[41] Z.W. Lv, J.T. Wang, F.Y. Wang, J.Q. Wang, F.Q. Li, and H.T. Chen, Effect of the addition of Cu₆Sn₅ nanoparticles on the growth of intermetallic compounds at the interfaces of Sn3.0Ag0.5Cu solder joints, Mater. Lett., 355(2024), art. No. 135407.

[42] Min ZX, Qiu Y, Hu XW, Wang HZ. Effect of Cu₆Sn₅ nanoparticles size on the properties of Sn0.3Ag0.7Cu nanocomposite solders and joints. J. Mater. Sci.: Mater. Electron., 2019, 30(1514726

[43] Hu XW, Qiu Y, Jiang XX, Li YL. Effect of Cu₆Sn₅ nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys. J. Mater. Sci.: Mater. Electron., 2018, 29(1815983

[44] Tai F, Guo F, Han MT, Xia ZD, Lei YP, Shi YW. Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder. Mater. Sci. Eng. A, 2010, 527(153335

[45] Yuan P, Chen DD, Qin JH, et al.. Effects of Ag₃Sn nanoparticles and isothermal aging on IMC layer growth, mechanical properties, and life prediction of SAC305/Cu solder joints. Compos. Adv. Mater, 2023, 32: 26349833231163598

[46] Wei YH, Liu YX, Tan CW, Zhang J, Zhao XC. Effect of nano-Ag3Sn additions on wettability, interfacial intermetallic growth and mechanical properties of Zn–30Sn–1Ge solders on Cu substrates. J. Mater. Sci.: Mater. Electron., 2020, 31(85796

[47] Chuang TH, Wu MW, Chang SY, Ping SF, Tsao LC. Strengthening mechanism of nano-Al₂O₃ particles reinforced Sn3.5Ag0.5Cu lead-free solder. J. Mater. Sci.: Mater. Electron., 2011, 22(81021

[48] Xing WQ, Yu XY, Li H, et al.. Microstructure and mechanical properties of Sn–9Zn–xAl₂O₃ nanoparticles (x=01) lead-free solder alloy: First-principles calculation and experimental research. Mater. Sci. Eng. A, 2016, 678: 252

[49] Eid EA, Basaty ABE, Deghady AM, Kaytbay S, Nassar A. Influence of nano-metric Al₂O₃ particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn–5.0Zn–0.3Cu Pb-free solder alloy. J. Mater. Sci.: Mater. Electron., 2019, 30(44326

[50] Yang L, Ge JG, Zhang YC, Dai J, Jing YF. Electromigration reliability for Al₂O₃-reinforced Cu/Sn–58Bi/Cu composite solder joints. J. Mater. Sci.: Mater. Electron., 2017, 28(33004

[51] Wu J, Xue SB, Wang JW, Wu MF, Wang JH. Effects of α-Al₂O₃ nanoparticles-doped on microstructure and properties of Sn–0.3Ag–0.7Cu low-Ag solder. J. Mater. Sci.: Mater. Electron., 2018, 29(97372

[52] Tsao LC, Wu RW, Cheng TH, Fan KH, Chen RS. Effects of nano-Al₂O₃ particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads. Mater. Des., 2013, 50: 774

[53] Tsao LC, Chang SY, Lee CI, Sun WH, Huang CH. Effects of nano-Al₂O₃ additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder. Mater. Des., 2010, 31(104831

[54] Zhu WB, Ma Y, Li XZ, Zhou W, Wu P. Effects of Al₂O₃ nanoparticles on the microstructure and properties of Sn58Bi solder alloys. J. Mater. Sci.: Mater. Electron., 2018, 29(97575

[55] Sun L, Zhang L, Zhang Y, et al.. Interfacial reaction and properties of Sn0.3Ag0.7Cu containing nano-TiN solder joints. J. Mater. Sci.: Mater. Electron., 2022, 33(63320

[56] El-Daly AA, Al-Ganainy GS, Fawzy A, Younis MJ. Structural characterization and creep resistance of nano-silic-on carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy. Mater. Des., 2014, 55: 837

[57] Wang X, Liu YC, Wei C, Gao HX, Jiang P, Yu LM. Strengthening mechanism of SiC-particulate reinforced Sn–3.7Ag–0.9Zn lead-free solder. J. Alloy. Compd., 2009, 480(2662

[58] El-Daly AA, Fawzy A, Mansour SF, Younis MJ. Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance. Mater. Sci. Eng. A, 2013, 578: 62

[59] M.K. Pal, G. Gergely, D. Koncz-Horváth, and Z. Gácsi, Investigation of microstructure and wetting behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate, Intermetallics, 128(2021), art. No. 106991.

[60] L.M. Yin, Z.W. Zhang, Z.L. Su, et al., Interfacial microstructure evolution and properties of Sn–0.3Ag–0.7Cu–xSiC solder joints, Mater. Sci. Eng. A, 809(2021), art. No. 140995.

[61] Li ML, Gao LL, Zhang L, Long WM, Zhong SJ, Zhang L. Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling. J. Mater. Res. Technol., 2021, 15: 3974

[62] Li ML, Zhang L, Jiang N, Zhong SJ, Zhang L. Influences of silicon carbide nanowires’ addition on IMC growth behavior of pure Sn solder during solid-liquid diffusion. J. Mater. Sci.:Mater. Electron., 2021, 32(1318067

[63] Skwarek A, Illés B, Górecki P, Pietruszka A, Tarasiuk J, Hurtony T. Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints. J. Mater. Res. Technol., 2023, 22: 403

[64] Pal MK, Gergely G, Gácsi Z. Growth kinetics and IMCs layer analysis of SAC305 solder with the reinforcement of SiC during the isothermal aging condition. J. Mater. Res. Technol., 2023, 24: 8320

[65] B. Illés, P.P. Michalowski, A. Skwarek, et al., Dispersion and incorporation of TiO₂ and SiC nano-particles in SAC alloy: SIMS and DFT study, Scripta Mater., 243(2024), art. No. 115987.

[66] M.K. Pal, G. Gergely, D. Koncz-Horváth, and Z. Gácsi, Characterization of the interface between ceramics reinforcement and lead-free solder matrix, Surf. Interfaces, 20(2020), art. No. 100576.

[67] Rajendran SH, Kang H, Jung JP. Ultrasonic-assisted dispersion of ZnO nanoparticles to Sn-Bi solder: A study on microstructure, spreading, and mechanical properties. J. Mater. Eng. Perform., 2021, 30(53167

[68] El-Daly AA, Elmosalami TA, Desoky WM, El-Shaarawy MG, Abdraboh AM. Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0Ag–0.5Cu lead-free solder. Mater. Sci. Eng. A, 2014, 618: 389

[69] Fawzy A, Fayek SA, Sobhy M, Nassr E, Mousa MM, Saad G. Tensile creep characteristics of Sn–3.5Ag–0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles. Mater. Sci. Eng. A, 2014, 603: 1

[70] Fouda AN, Eid EA. Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy. Mater. Sci. Eng. A, 2015, 632: 82

[71] Mansour MM, Saad G, Wahab LA, Fawzy A. Indentation creep behavior of thermally aged Sn–5wt%Sb–1.5wt%Ag solder integrated with ZnO nanoparticles. J. Mater. Sci.: Mater. Electron., 2019, 30(98348

[72] Sobhy M, El-Refai AM, Mousa MM, Saad G. Effect of ageing time on the tensile behavior of Sn–3.5wt% Ag–0.5wt% Cu (SAC355) solder alloy with and without adding ZnO nanoparticles. Mater. Sci. Eng. A, 2015, 646: 82

[73] Wu N, Ismathullakhan S, Chan YC. Effect of 1wt% ZnO nanoparticles addition on the microstructure, IMC development, and mechanical properties of high Bi content Sn–57.6Bi–0.4Ag solder on Ni metalized Cu pads. J. Mater. Sci.: Mater. Electron., 2014, 25(52169

[74] Eid EA, Fouda AN, Duraia EM. Effect of adding 0.5wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn–5.0wt% Sb–0.5wt% Cu (SSC505) lead free solder alloy. Mater. Sci. Eng. A, 2016, 657: 104

[75] Sobhy M. Effects of torsional oscillation on tensile behavior of Sn–3.5wt% Ag alloy with and without adding ZnO nanoparticles. Mater. Sci. Eng. A, 2014, 610: 237

[76] S.H. Rajendran, S.M. Seo, and J.P. Jung, Effect of 0D and 1D ZnO nano additive reinforced Sn–3.0Ag–0.5Cu solder paste on InGaN LED chip/ENIG joints, Mater. Toeay Commun., 35(2023), art. No. 105795.

[77] A. Skwarek, O. Krammer, T. Hurtony, et al., Application of ZnO nanoparticles in Sn99Ag0.3Cu0.7-based composite solder alloys, Nanomaterials, 11(2021), No. 6, art. No. 1545.

[78] P. Liu, K.K. Zhang, B.Y. Wang, R.Q. Hou, H.G. Wang, and Y. Gao, Study on the properties of low silver Sn1.0Ag0.5Cu composite solder reinforced with nickel-plated zinc oxide and its soldering joint, Mater. Today Commun., 37(2023), art. No. 107040.

[79] Tsao LC. Suppressing effect of 0.5wt.% nano-TiO₂ addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging. J. Alloy. Compd., 2011, 509(338441

[80] Salleh MAAM, McDonald SD, Gourlay CM, Yasuda H, Nogita K. Suppression of Cu₆Sn₅ in TiO₂ reinforced solder joints after multiple reflow cycles. Mater. Des., 2016, 108: 418

[81] Illés B, Choi H, Hurtony T, Dušek K, Bušek D, Skwarek A. Suppression of Sn whisker growth from SnAgCu solder alloy with TiO₂ and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy. J. Mater. Res. Technol., 2022, 20: 4231

[82] Tsao LC, Chang SY. Effects of Nano-TiO₂ additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder. Mater. Des., 2010, 31(2990

[83] Chuang TH, Tsao LC, Chung CH, Chang SY. Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging. Mater. Des., 2012, 39: 475

[84] Tang Y, Li GY, Pan YC. Influence of TiO₂ nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO₂ solder joints in reflow process. J. Alloy. Compd., 2013, 554: 195

[85] Wen YN, Zhao XC, Chen Z, et al.. Reliability enhancement of Sn–1.0Ag–0.5Cu nano-composite solders by adding multiple sizes of TiO₂ nanoparticles. J. Alloy. Compd., 2017, 696: 799

[86] Jung DH, Sharma A, Jung JP. Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn–Ag–Cu and a Cu conductor. J. Alloy. Compd., 2018, 743: 300

[87] Tsao LC, Huang CH, Chung CH, Chen RS. Influence of TiO₂ nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder. Mater. Sci. Eng. A, 2012, 545: 194

[88] Shen J, Chan YC. Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layer. J. Alloy. Compd., 2009, 477(1–2909

[89] Shen J, Liu YC, Wang DJ, Gao HX. Nano ZrO₂ particulate-reinforced lead-free solder composite. J. Mater. Sci. Technol., 2006, 22(4529

[90] Gain AK, Fouzder T, Chan YC, Yung WKC. Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO₂ composite solder on OSP-Cu pads. J. Alloy. Compd., 2011, 509(73319

[91] Shen J, Liu YC, Han YJ, Tian YM, Gao HX. Strengthening effects of ZrO₂ nanoparticles on the microstructure and microhardness of Sn–3.5Ag lead-free solder. J. Electron. Mater., 2006, 35(81672

[92] Gain AK, Chan YC, Yung WKC. Effect of additions of ZrO₂ nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads. Microelectron. Reliab., 2011, 51(122306

[93] Gain AK, Chan YC. Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu–1wt% nano-ZrO₂ composite solders. Microelectron. Reliab., 2014, 54(5945

[94] Gain AK, Zhang LC. Microstructure, mechanical and electrical performances of zirconia nanoparticles-doped tin–silver–copper solder alloys. J. Mater. Sci.: Mater. Electron., 2016, 27(77524

[95] Chen B, Wang HZ, Zou MM, Hu XW, Chen WJ, Jiang XX. Evolution of interfacial IMCs and mechanical properties of Sn-Ag-Cu solder joints with Cu-modified carbon nanotube. J. Mater. Sci.: Mater. Electron., 2022, 33(2419160

[96] Chen G, Wu FS, Liu CQ, Silberschmidt VV, Chan YC. Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets. J. Alloy. Compd., 2016, 656: 500

[97] Y.D. Han, Y. Gao, S.T. Zhang, et al., Study of mechanical properties of Ag nanoparticle-modified graphene/Sn–Ag–Cu solders by nanoindentation, Mater. Sci. Eng. A, 761(2019), art. No. 138051.

[98] Y. Li, L.Y. Xu, H.Y. Jing, L. Zhao, K.D. Hao, and Y.D. Han, Study on the floating kinetics of graphene in molten Sn-based alloy based on in situ observation of X-ray radiography, Composites Part B: Eng., 238(2022), art. No. 109909.

[99] Mao J, Yang WC, Song QQ, et al.. The effects of the addition of CNT@Ni on the hardness, density, wettability and mechanical properties of Sn–0.7Cu lead-free solder. J. Mater. Sci.: Mater. Electron., 2021, 32(810843

[100] Ma DL, Wu P. Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets. J. Alloy. Compd., 2016, 671: 127

[101] M. Tamizi, M. Movahedi, A.H. Kokabi, and Y. Miyashita, Cobalt-graphene nanosheets enhanced Sn–0.3Ag–0.7Cu composite solder: Study on microstructure, crystal orientation relations and mechanical properties, Mater. Sci. Eng. A, 894(2024), art. No. 146199.

[102] Lv Y, Yang WC, Mao J, Li YT, Zhang XJ, Zhan YZ. Effect of graphene nano-sheets additions on the density, hardness, conductivity, and corrosion behavior of Sn–0.7Cu solder alloy. J. Mater. Sci.: Mater. Electron., 2020, 31(1202

[103] Ma Y, Li XZ, Yang LZ, et al.. Effects of graphene nanosheets addition on microstructure and mechanical properties of SnBi solder alloys during solid-state aging. Mater. Sci. Eng. A, 2017, 696: 437

[104] L. Yang, G.Q. Wang, Y.C. Zhang, Y.F. Xiong, and W. Jiang, Influence of tungsten carbide(WC) nanoparticle on microstructure and mechanical properties of Cu/Sn57.6Bi0.4Ag/Cu solder joints, Appl. Phys. A, 124(2018), No. 12, art. No. 849.

[105] Shen J, Peng CF, Yin HG, Chen J. Influence of minor POSS molecules additions on the microstructure and hardness of Sn3Ag0.5Cu–xPOSS composite solders. J. Mater. Sci.: Mater. Electron., 2012, 23(91640

[106] B. Chen, M.M. Zou, W.J. Chen, et al., Influence of CrFeCoNiCu high-entropy alloy and ultrasonic stirring on the thermal, electrochemical and mechanical properties of Zn–30Sn high-temperature solder alloy, Mater. Charact., 201(2023), art. No. 112977.

[107] Rajendran SH, Jung DH, Jung JP. Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints. J. Mater. Sci.: Mater. Electron., 2022, 33(73687

RIGHTS & PERMISSIONS

University of Science and Technology Beijing