Microbiologically influenced corrosion resistance enhancement of copper-containing high entropy alloy FexCu(1−x)CoNiCrMn against Pseudomonas aeruginosa
Yuntian Lou , Weiwei Chang , Yu Zhang , Shengyu He , Xudong Chen , Hongchang Qian , Dawei Zhang
International Journal of Minerals, Metallurgy, and Materials ›› 2024, Vol. 31 ›› Issue (11) : 2488 -2497.
Microbiologically influenced corrosion resistance enhancement of copper-containing high entropy alloy FexCu(1−x)CoNiCrMn against Pseudomonas aeruginosa
To enhance the microbiologically influenced corrosion (MIC) resistance of FeCoNiCrMn high entropy alloy (HEAs), a series of FexCu(1−x)CoNiCrMn (x = 1, 0.75, 0.5, and 0.25) HEAs were prepared. Microstructural characteristics, corrosion behavior (morphology observation and electrochemical properties), and antimicrobial performance of FexCu(1−x)CoNiCrMn HEAs were evaluated in a medium inoculated with typical corrosive microorganism Pseudomonas aeruginosa. The aim was to identify copper-containing FeCoNiCrMn HEAs that balance corrosion resistance and antimicrobial properties. Results revealed that all FexCu(1−x)CoNiCrMn (x = 1, 0.75, 0.5, and 0.25) HEAs exhibited an FCC (face centered cubic) phase, with significant grain refinement observed in Fe0.75Cu0.25CoNiCrMn HEA. Electrochemical tests indicated that Fe0.75Cu0.25CoNiCrMn HEA demonstrated lower corrosion current density (icorr) and pitting potential (Epit) compared to other FexCu(1−x)CoNiCrMn HEAs in P. aeruginosa-inoculated medium, exhibiting superior resistance to MIC. Anti-microbial tests showed that after 14 d of immersion, Fe0.75Cu0.25CoNiCrMn achieved an antibacterial rate of 89.5%, effectively inhibiting the adhesion and biofilm formation of P. aeruginosa, thereby achieving resistance to MIC.
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