Electroless copper-phosphorus coatings with the addition of silicon carbide (SiC) particles

Abstract

Cu-P-silicon carbide (SiC) composite coatings were deposited by means of electroless plating. The effects of pH values, temperature, and different concentrations of sodium hypophosphite (NaH₂PO₂·H₂O), nickel sulfate (NiSO₄·6H₂O), sodium citrate (C₆H₅Na₃O₇·2H₂O) and SiC on the deposition rate and coating compositions were evaluated, and the bath formulation for Cu-P-SiC composite coatings was optimised. The coating compositions were determined using energy-dispersive X-ray analysis (EDX). The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows: pH 9; temperature, 90°C; NaH₂PO₂·H₂O concentration, 125 g/L; NiSO₄·6H₂O concentration, 3.125 g/L; SiC concentration, 5 g/L; and C₆H₅Na₃O₇·2H₂O concentration, 50 g/L. The surface morphology of the coatings analysed by scanning electron microscopy (SEM) shows that Cu particles are uniformly distributed. The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.

Keywords

electroless deposited coating / electroless copper plating / silicon carbide particles / sodium hypophosphite / hardness / wear resistance

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