High heat loading performance of actively cooled W/Cu FGM-based components

Abstract

A functionally graded material-based actively water-cooled tungsten-copper mockup with a dimension of 30 mm×30 mm×25 mm was designed and fabricated by infiltration-brazing method. The thicknesses of the pure W layer and W/Cu graded layer were 2 and 3 mm, respectively. High heat flux tests were performed on the mockup using an e-beam device. There is no damage occurring on the joint after heat loading at 5 MW/m². The temperature on the pure W surface is less than 500°C after irradiation for 100 s at 5 MW/m², while the temperature on the brazing seam/copper surface is around 200°C.

Keywords

tungsten / copper / functionally graded materials / thermal load

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