Electrical conductivity changes of bulk tin and Sn-3.0Ag-0.5Cu in bulk and in joints during isothermal aging

Abstract

The changes of electrical conductivity (resistance) between Sn-3.0Ag-0.5Cu solder joints and printed circuit board (PCB) assembly during aging at 125°C were investigated by the four-point probe technique. The microstructural characterizations of interfacial layers between the solder matrix and the substrate were examined by optical microscopy and scanning electronic microscopy. Different types of specimens were designed to consider several factors. The experimental results indicate that electrical conductivities (resistances) and residual shear strengths of the solder joint specimens significantly decrease after 1000 h during isothermal aging. Microcracks generate in the solder matrix at the first 250 h. Besides, the evolutions of microstructural characterizations at the interface and the matrix of solder joints were noted in this research.

Keywords

lead-free solder / electrical conductivity / isothermal aging, microcrack / thermal stress

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