Advancements in Flexible Ceramic Fibers for High-Temperature Applications: A Comprehensive Review

Zijian Xu , Ying Lyu , Chao Hou , Yanqi Han , Yunzhao Bai , YongAn Huang , Kan Li

High-Temp. Mat. ›› 2025, Vol. 2 ›› Issue (2) : 10007

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High-Temp. Mat. ›› 2025, Vol. 2 ›› Issue (2) :10007 DOI: 10.70322/htm.2025.10007
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Advancements in Flexible Ceramic Fibers for High-Temperature Applications: A Comprehensive Review
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Abstract

Flexible ceramic fibers (FCFs) have emerged as a highly promising material for high-temperature applications, effectively combining the excellent thermal stability of ceramic materials with the robust mechanical properties of flexible fibers. This review provides a comprehensive overview of recent advances in multifunctional FCF devices, focusing on innovative methods across material selection, structural design, and fabrication techniques to enhance their functional properties. These improvements, i.e., mechanical strength, thermal conductivity, and oxidation resistance, make FCFs particularly suitable for a wide range of applications, including energy storage, sensing, and high-temperature filtration. Notably, advancements in fabrication techniques have enabled the creation of novel FCF devices for thermal insulation and high-temperature sensing, such as stretchable ceramic membranes and printable ceramic fiber papers. The review concludes by discussing the future potential of FCFs, especially in multifunctional applications in high-temperature environments, where they can serve as essential components of advanced technologies. This work highlights the versatility and potential of FCFs as a transformative material for next-generation high-temperature applications.

Keywords

Flexible ceramic fibers / High-temperature / Multifunctionalization

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Zijian Xu, Ying Lyu, Chao Hou, Yanqi Han, Yunzhao Bai, YongAn Huang, Kan Li. Advancements in Flexible Ceramic Fibers for High-Temperature Applications: A Comprehensive Review. High-Temp. Mat., 2025, 2(2): 10007 DOI:10.70322/htm.2025.10007

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Acknowledgments

The authors acknowledge the State Key Laboratory of Manufacturing Equipment and Technology, Institute for Advanced Electronics Manufacturing for the support in the writing of this manuscript. During the preparation of this work the authors used Grammarly in order to improve readability and language. After using this tool, the authors reviewed and edited the content as needed and take full responsibility for the content of the publication.

Author Contributions

Conceptualization, Z.X. and K.L.; Investigation, Z.X., C.H. and Y.B.; Data Curation, Z.X., Y.L. and Y.H. (Yanqi Han); Writing—Original Draft Preparation, Z.X., Y.L. and Y.H. (Yanqi Han); Writing—Review & Editing, Z.X. and K.L.; Visualization, Z.X.; Project Administration, Y.H. (YongAn Huang) and K.L.; Funding Acquisition, Y.H. (YongAn Huang) and K.L.

Ethics Statement

Not applicable.

Informed Consent Statement

Not applicable.

Data Availability Statement

The data that support the findings of this study are available from the corresponding author, upon reasonable request.

Funding

This research was funded by the National Natural Science Foundation of China (Grant No. 52375566), the National Natural Science Foundation of China (Grant No. 52427809) and the Xplorer Prize (2020-1036).

Declaration of Competing Interest

The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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