Reconfigurable intelligent surfaces for wireless communications

Qiang CHENG , Shi JIN , Tie Jun CUI

Front. Inform. Technol. Electron. Eng ›› 2023, Vol. 24 ›› Issue (12) : 1665 -1668.

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Front. Inform. Technol. Electron. Eng ›› 2023, Vol. 24 ›› Issue (12) : 1665 -1668. DOI: 10.1631/FITEE.2320000
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Reconfigurable intelligent surfaces for wireless communications

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Qiang CHENG, Shi JIN, Tie Jun CUI. Reconfigurable intelligent surfaces for wireless communications. Front. Inform. Technol. Electron. Eng, 2023, 24(12): 1665-1668 DOI:10.1631/FITEE.2320000

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