Heterogeneous III-V silicon photonic integration: components and characterization

Shang-jian ZHANG , Yong LIU , Rong-guo LU , Bao SUN , Lian-shan YAN

Front. Inform. Technol. Electron. Eng ›› 2019, Vol. 20 ›› Issue (4) : 472 -480.

PDF (1188KB)
Front. Inform. Technol. Electron. Eng ›› 2019, Vol. 20 ›› Issue (4) : 472 -480. DOI: 10.1631/FITEE.1800482
Review
Review

Heterogeneous III-V silicon photonic integration: components and characterization

Author information +
History +
PDF (1188KB)

Abstract

Heterogeneous III-V silicon (Si) photonic integration is considered one of the key methods for realizing power- and cost-effective optical interconnections, which are highly desired for future high-performance computers and datacenters. We review the recent progress in heterogeneous III-V/Si photonic integration, including transceiving devices and components. We also describe the progress in the on-wafer characterization of photonic integration circuits, especially on the heterogeneous III-V/Si platform.

Keywords

Heterogeneous photonic integration / Optical interconnection / On-wafer characterization

Cite this article

Download citation ▾
Shang-jian ZHANG, Yong LIU, Rong-guo LU, Bao SUN, Lian-shan YAN. Heterogeneous III-V silicon photonic integration: components and characterization. Front. Inform. Technol. Electron. Eng, 2019, 20(4): 472-480 DOI:10.1631/FITEE.1800482

登录浏览全文

4963

注册一个新账户 忘记密码

References

RIGHTS & PERMISSIONS

Zhejiang University and Springer-Verlag GmbH Germany, part of Springer Nature

AI Summary AI Mindmap
PDF (1188KB)

Supplementary files

FITEE-0472-19003-SJZ_suppl_2

2009

Accesses

0

Citation

Detail

Sections
Recommended

AI思维导图

/