Deep learning compact binary codes for fingerprint indexing

Chao-chao BAI , Wei-qiang WANG , Tong ZHAO , Ru-xin WANG , Ming-qiang LI

Front. Inform. Technol. Electron. Eng ›› 2018, Vol. 19 ›› Issue (9) : 1112 -1123.

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Front. Inform. Technol. Electron. Eng ›› 2018, Vol. 19 ›› Issue (9) : 1112 -1123. DOI: 10.1631/FITEE.1700420
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Deep learning compact binary codes for fingerprint indexing

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Abstract

With the rapid growth in fingerprint databases, it has become necessary to develop excellent fingerprint indexing to achieve efficiency and accuracy. Fingerprint indexing has been widely studied with real-valued features, but few studies focus on binary feature representation, which is more suitable to identify fingerprints efficiently in large-scale fingerprint databases. In this study, we propose a deep compact binary minutia cylinder code (DCBMCC) as an effective and discriminative feature representation for fingerprint indexing. Specifically, the minutia cylinder code (MCC), as the state-of-the-art fingerprint representation, is analyzed and its shortcomings are revealed. Accordingly, we propose a novel fingerprint indexing method based on deep neural networks to learn DCBMCC. Our novel network restricts the penultimate layer to directly output binary codes. Moreover, we incorporate independence, balance, quantization-loss-minimum, and similarity-preservation properties in this learning process. Eventually, a multi-index hashing (MIH) based fingerprint indexing scheme further speeds up the exact search in the Hamming space by building multiple hash tables on binary code substrings. Furthermore, numerous experiments on public databases show that the proposed approach is an outstanding fingerprint indexing method since it has an extremely small error rate with a very low penetration rate.

Keywords

Fingerprint indexing / Minutia cylinder code / Deep neural network / Multi-index hashing

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Chao-chao BAI, Wei-qiang WANG, Tong ZHAO, Ru-xin WANG, Ming-qiang LI. Deep learning compact binary codes for fingerprint indexing. Front. Inform. Technol. Electron. Eng, 2018, 19(9): 1112-1123 DOI:10.1631/FITEE.1700420

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