Editorial board

Editor-in-Chief: 

Nanping Xu, Suzhou National Laboratory, Suzhou 215000,Jiangsu, China

Associate Editor-in-Chief:

Baode Sun, Suzhou National Laboratory / Shanghai Jiao Tong University,China    

Executive Editor-in-Chief: 

Yanchun Zhou, Suzhou National Laboratory, Suzhou, China

Members of Editorial Board (In alphabetical order)

Artem R. Oganov, Skolkovo Institute of Science and Technology, Russia

Benoît Boulanger, University Grenoble Alpes, France

Bingbo Wei, Northwestern Polytechnical University, China

Bouchta Sahraoui, University of Angers, France

Eugene A. Olevsky, San Diego State University, USA

Evamarie Hey-Hawkins, Leipzig University, Germany

Feng Ding, Suzhou National Laboratory, China

In Chung, Seoul National University, South Korea

Ion Tiginyanu, Technical University of Moldova, Moldova

Ji Zhou, Tsinghua University / Suzhou National Laboratory, China

Jianxin Xie, University of Science and Technology / Suzhou National Laboratory, Beijing, China

Johan Hofkens, KU Leuven, Belgium

John C. Crittenden, Georgia Institute of Technology, USA

John N. Saddler, University of British Columbia, Canada

Lei Jiang, University of Science and Technology of China / Suzhou National Laboratory, China

Mingxing Zhang, University of Queensland, Australia

Mingzhou Jin, University of Tennessee, Knoxville, USA

Osamu Umezawa, Yokohama National University, Japan

Pingxiang Zhang, Northwest Institute for Non-Ferrous Metal Research, China

Ragnvald H. Mathiesen, Norwegian University of Science and Technology, Norway

Richard I. Todd, University of Oxford, UK

Rodney S. Ruoff, Ulsan National Institute of Science and Technology, South Korea

Tianwei Tan, Beijing University of Chemical Technology, China

Tiejun Cui, Southeast University / Suzhou National Laboratory, China

Turab Lookman, Xi'an Jiaotong University, China

Yan Lu, Helmholtz Centre Berlin for Materials and Energy, Germany

Yanrong Li, Sichuan University, China

Zhiliang Zhang, Norwegian University of Science and Technology, Norway

Zuoren Nie, Beijing University of Technology, China

 




Pubdate:     Viewed: