Atomic Layer Deposition for Electrochemical Energy: from Design to Industrialization

Zhe Zhao; Gaoshan Huang; Ye Kong; Jizhai Cui; Alexander A. Solovev; Xifei Li; Yongfeng Mei

doi:10.1007/s41918-022-00146-6

Electrochemical Energy Reviews ›› 2022, Vol. 5 ›› Issue (Suppl 1) DOI: 10.1007/s41918-022-00146-6

Review Article

Atomic Layer Deposition for Electrochemical Energy: from Design to Industrialization

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¹Department of Materials Science & State Key Laboratory of Molecular Engineering of Polymers, Fudan University, 200438, Shanghai, China

²Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Fudan University, 200438, Shanghai, China

³Institute of Advanced Electrochemical Energy & School of Materials Science and Engineering, Xi′an University of Technology, Xi′an 710048, Shaanxi, China

⁴International Institute of Intelligent Nanorobots and Nanosystems, Fudan University, 200438, Shanghai, China

⁵Yiwu Research Institute of Fudan University, Yiwu 322000Zhejiang, China

^g yfm@fudan.edu.cn

Zhe Zhao

obtained his PhD degree at Fudan University in 2022. Now, He is a postdoc researcher in the Department of Materials Science at Fudan University. His research interest includes the design and synthesis of nanomaterials, new structural electrode materials for electrocatalysts, energy storage devices, and sensors.

Gaoshan Huang

received his PhD degree in condensed matter physics at Nanjing University, China in 2007. After graduation, he worked in IFW Dresden, Germany as a guest scientist. Then he moved to IMRE, Singapore as a research engineer. In 2010, he joined the Department of Materials Science, Fudan University, China. Currently, he is a profess or of materials science at Fudan University. His research interest is fabrications and characterizations of low dimensional structures.

Yongfeng Mei

received his BS and MS degrees in physics from Nanjing University and PhD degree in materials physics from the City University of Hong Kong. He is a professor in materials physics and chemistry and associated department head in the Department of Materials Science at Fudan University (China). Before that, he worked as a post doctoral researcher in the Max Planck Institute for Solid State Research (Germany) and then led a research group in the Leibniz Institute for Solid State and Materials Research Dresden (Germany) as a staff scientist. His research interest focuses on the materials development in micro/nanorobotics, flexible electronics/optoelectronics and nanophotonics.

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Abstract

Abstract

The demand for high-performance devices that are used in electrochemical energy conversion and storage has increased rapidly. Tremendous efforts, such as adopting new materials, modifying existing materials, and producing new structures, have been made in the field in recent years. Atomic layer deposition (ALD), as an effective technique for the deposition of conformal and thickness-controllable thin films, has been widely utilized in producing electrode materials for electrochemical energy devices. Recent strategies have emerged and been developed for ALD to construct nanostructured architectures and three-dimensional (3D) micro/nanostructures. These strategies emphasize the preparation of active materials for devices such as batteries and supercapacitors or as catalysts for hydrogen evolution. Additionally, ALD is considered to have great potential in practical industrial production. In this review, we focus on the recent breakthroughs of ALD for the design of advanced materials and structures in electrochemical energy devices. The function and merits of ALD will be discussed in detail from traditional thin film depositions for the coating and engineering/modification layers to complex 3D micro/nanostructures that are designed for active materials. Furthermore, recent works regarding metal–organic framework films and transition metal dichalcogenide films, which were prepared with the assistance of ALD oxide, will be highlighted, and typical examples will be demonstrated and analysed. Because it is within a rapidly developing field, we believe that ALD will become an industrial deposition method that is important, commercially available, and widely used in electrochemical energy devices.

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Zhe Zhao, Gaoshan Huang, Ye Kong, Jizhai Cui, Alexander A. Solovev, Xifei Li, Yongfeng Mei. Atomic Layer Deposition for Electrochemical Energy: from Design to Industrialization. Electrochemical Energy Reviews, 2022, 5(Suppl 1): DOI:10.1007/s41918-022-00146-6