Electrochemical-discharge-assisted grinding of rotating quartz glass surfaces regulated by a thin electrolyte film
Jia-Long Chen , Hao Tong , Yong Li , Yu-Jie Liu
Advances in Manufacturing ›› : 1 -15.
Quartz glass is widely used in semiconductors, optics, and inertial navigation owing to its superior properties. However, conventional grinding of quartz glass causes surface and subsurface damage (SSD) owing to brittle fracture removal. The hybrid process of electrochemical-discharge-assisted grinding (ECDAG) employs high temperatures from discharges and chemical reactions to soften quartz glass, enabling a plastic removal mode for improved quality and efficiency. Formation of a thin electrolyte film on the workpiece surface is essential for ECDAG. However, the existing methods for film formation are not directly applicable to ECDAG on rotary surfaces. Furthermore, the effect of film thickness on the coupling of the discharge-grinding energy is unclear in ECDAG. In this study, a novel method for forming a thin film by immersing and rotating a quartz workpiece in an electrolyte was proposed to achieve simultaneous electrochemical discharge and grinding. The influence of the workpiece rotation speed and immersion depth on the film thickness was investigated through theoretical analysis and experiments. The matching of the discharge-grinding energy was analyzed by considering the key factor of workpiece rotation speed. Comparative experiments showed that the plastic removal of the material could be achieved by ECDAG under an electrolyte film thickness of 6−15 μm, resulting in a reduction of surface roughness by 86.2% to 0.214 μm, a greater machined groove depth, and decreased subsurface damage compared with that achieved by conventional grinding.
Electrochemical-discharge-assisted grinding (ECDAG) / Thin electrolyte films / Quartz glass / Plastic domain grinding
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Shanghai University and Periodicals Agency of Shanghai University and Springer-Verlag GmbH Germany, part of Springer Nature
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