Low-cost and mass fabrication of microfluidic chips by laminating SAF2100 photosensitive dry film onto a polycarbonate substrate

Jia-Hao Wang , Yue Wang , Hong-Ze Yin , Hui-Ying Yang , Juan Zhang , Shi-Wei Chen , Tian-Bin He , Yuan-Jie Gan , Na Liu , Tao Yue

Advances in Manufacturing ›› : 1 -18.

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Advances in Manufacturing ›› :1 -18. DOI: 10.1007/s40436-026-00625-9
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Low-cost and mass fabrication of microfluidic chips by laminating SAF2100 photosensitive dry film onto a polycarbonate substrate
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Abstract

Microfluidic chips have been widely used; however, traditional manufacturing methods struggle to meet the demands of low-cost and large-scale production. In particular, the preparation of microfluidic chip molds primarily employs silicon wafers and glass substrates, with limited attention being paid to polymer substrates. In this study, an SAF2100 photosensitive dry film was used to prepare microfluidic chip molds with different aspect ratios on polycarbonate (PC) surfaces. The weak adhesion between the dry film and the PC substrate was improved by a 3-mercaptopropyltrimethoxysilane (MPTMS) solution, and the problem of difficult peeling between the dry film and polydimethylsiloxane (PDMS) was enhanced by a trichloro(1H,1H,2H,2H-perfluorooctyl) silane (PFOCTS) solution. Initially, a single layer (100 μm) of dry film was stacked by lamination, and the effects of lamination temperature and lamination frequency on bond strength were investigated. The optimal parameters for temperature and lamination were 95 °C and four laminations, respectively. Subsequently, the exposure time parameters of the dry film were studied, and the optimal exposure times (OETs) for 1–5 layers of the dry film were determined using the edge sharpness value method, with the results being 20, 60, 50, 110, and 110 s, respectively. Next, the effect of dry film thickness after lamination is discussed. The results indicated that fewer dry film layers resulted in greater thickness variation after lamination. Specifically, the final thickness of a single layer of dry film after lamination was (96.2 ± 0.2) μm, and the final thickness of five layers of dry film after lamination was (500 ± 0.09) μm. The bonding strength between the dry film and the PC substrate was improved through surface grafting. The bonding strength increased from 25.53 kPa to 89.37 kPa after treatment. Increasing the grafting time also affects the bonding strength, with the bonding strength increasing from 11.51 kPa to 121.14 kPa after 5 min of grafting. After the development, the dry film surface was modified using PFOCTS. After modification, the water contact angle increased from 73.87° ± 3.48° to 122.83° ± 4.02°. After casting PDMS of equal mass, the peel force was measured, and the bond strength was significantly reduced after the surface treatment. Finally, the peeled microfluidic channels were bonded to form a microfluidic chip, and the channel sealing and droplet generation performances were verified. This study provides a reference for the preparation of high-aspect-ratio microfluidic chips for low-cost, large-scale production.

Keywords

Microfluidic chip mold / SAF2100 photosensitive dry film / Surface silanization

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Jia-Hao Wang, Yue Wang, Hong-Ze Yin, Hui-Ying Yang, Juan Zhang, Shi-Wei Chen, Tian-Bin He, Yuan-Jie Gan, Na Liu, Tao Yue. Low-cost and mass fabrication of microfluidic chips by laminating SAF2100 photosensitive dry film onto a polycarbonate substrate. Advances in Manufacturing 1-18 DOI:10.1007/s40436-026-00625-9

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Funding

National Natural Science Foundation of China(62373235)

Shanghai Science and Technology Committee Natural Science Foundation(23ZR1423700)

Shanghai municipal education innovation project(2021-09-E00113)

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