Design and development of a high-precision intelligent double-sided lapping machine

Abstract

To address issues in traditional double-sided lapping machines, such as machining accuracy drift, structural thermal deformation, and insufficient intelligence, this study designed a high-precision double-sided lapping machine structure system oriented toward intelligent control systems, providing a physical carrier platform for subsequent system implementation. Based on the structural stability and dynamic adjustment requirements during machining, the machine adopted a swing-type structure and modular assembly architecture to construct a mechanical system with dynamic compensation characteristics. Finite-element-method-based static simulation and modal analysis ensured the rational design of critical components and structures while maintaining favorable dynamic stability. To resolve the lapping plate thermal deformation challenges, a low coefficient of thermal expansion (CTE) Invar alloy 4J36 was selected as the base material with embedded cooling channels designed to enhance temperature control. Fluid structure thermal interaction (FSTI) analysis shows that, under identical operating conditions, the thermal deformation of this material is reduced by nearly an order of magnitude compared with conventional alternative substrates. The machine integrates dual-airbag lever-pressurized mechanisms, high-rigidity lower-plate support structure, and dressing units. Simultaneously, a multi-source sensor network was embedded to provide the hardware foundations for data acquisition in intelligent control systems. Preliminary glass substrate machining experiments were conducted to verify the fundamental mechanical and structural performance. The results indicate that the total thickness variation (TTV) of the post-processed substrate is below 3 μm, validating the rationality and feasibility of the proposed design as a deployment and verification platform for subsequent intelligent control frameworks.

Keywords

Double-sided lapping / Structural design / Precision assurance / Intelligent control / Sensors

References

[1] Zhang ZY, Yan JW, Kuriyagawa T. Manufacturing technologies toward extreme precision. Int J Extrem Manuf, 2019, 1: 1-22

[2] Guo J, Pan B, Lian J, et al. . Recent development and prospective of double-sided lapping technology. J Mech Eng, 2024, 60: 266-288

[3] Li ZC, Pei ZJ, Fisher GR. Simultaneous double side grinding of silicon wafers: a literature review. Int J Mach Tools Manuf, 2006, 46: 1449-1458

[4] Pan B, Kang RK, Zhu X, et al. . Why parallelism of workpieces becomes convergent during double-sided lapping?. J Manuf Sci Eng Trans, 2023, 145: 074501

[5] Li ZY, Deng ZH, Ge JM, et al. . Experimental and theoretical analysis of single-sided and double-sided chemical mechanical polishing of sapphire wafers. Int J Adv Manuf Technol, 2022, 119: 5095-5106

[6] Li ZY, Deng ZH, Ge JM, et al. . Material removal rate prediction for sapphire double-sided CMP based on RSM-SVM. ECS J Solid State Sci Technol, 2022, 11 084002

[7] Li ZY, Deng ZH, Hu YX. Effects of polishing parameters on surface quality in sapphire double-sided CMP. Ceram Int, 2020, 46: 13356-13364

[8] Chen G, Hu ZW, Wang LJ, et al. . Modeling of material removal rate for the fixed-abrasive double-sided planetary grinding of a sapphire substrate. Materials, 2024, 17: 3688

[9] Wang LJ, Hu ZW, Yu YQ, et al. . Evaluation of double-sided planetary grinding using diamond wheels for sapphire substrates. Crystals, 2018, 8: 262

[10] Li W, Jin C, Hu XZ. A study on pressure stability in double-sided polishing process. Adv Mater Res, 2010, 126(128): 64-69

[11] Satake U, Enomoto T. Nonuniformity of material removal in a double-sided polishing process: formation of convex curves. Precis Eng J Int Soc Precis Eng Nanotechnol, 2022, 77: 281-292

[12] Satake U, Enomoto T. Polishing pad design for uniform removal distributions in double-sided polishing. CIRP Ann Manuf Technol, 2023, 72: 289-292

[13] Yu YQ, Hu ZW, Wang WS, et al. . The double-side lapping of SiC wafers with semifixed abrasives and resin-combined plates. Int J Adv Manuf Technol, 2020, 108: 997-1006

[14] Hu GX, Hu XD, Jin YF, et al. . The development of the precise double sided polishing machine. Key Eng Mater, 2006, 315(316): 375-379

[15] Zhang S, Shi HW, Wang CY et al (2019) Research on pneumatic control technology of medium and large diameter double-sided polishing machine. In: The 3rd international conference on photonics and optical engineering, Xi’an, China. https://doi.org/10.1117/12.2523563

[16] Zhao YW, Du JF, Wen SW, et al. . Research of the virtual prototyping and simulating on ultra-precision double-sided planar polishing machine. Adv Mater Res, 2009, 69(70): 34-38

Funding

National Natural Science Foundation of China(52475429)

RIGHTS & PERMISSIONS

Shanghai University and Periodicals Agency of Shanghai University and Springer-Verlag GmbH Germany, part of Springer Nature

Just Accepted

This article has successfully passed peer review and final editorial review, and will soon enter typesetting, proofreading and other publishing processes. The currently displayed version is the accepted final manuscript. The officially published version will be updated with format, DOI and citation information upon launch. We recommend that you pay attention to subsequent journal notifications and preferentially cite the officially published version. Thank you for your support and cooperation.