Study into grinding force in back grinding of wafer with outer rim

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Study into grinding force in back grinding of wafer with outer rim

Xiang-Long Zhu , Yu Li , Zhi-Gang Dong , Ren-Ke Kang , Shang Gao

Advances in Manufacturing ›› 2020, Vol. 8 ›› Issue (3) : 361 -368.

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Advances in Manufacturing ›› 2020, Vol. 8 ›› Issue (3) : 361 -368. DOI: 10.1007/s40436-020-00316-z

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Study into grinding force in back grinding of wafer with outer rim

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¹ Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, 116024, Dalian, People’s Republic of China

^d kangrk@dlut.edu.cn

Xiang-Long Zhu is an associate professor at the school of Mechanical Engineering, Dalian University of Technology, Dalian, China. His research interests include efficient processing technology and equipment for difficult-to-machine materials and precision/ultraprecision machining technology and equipment.

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Yu Li is currently a Graduate Student with the School of Mechanical Engineering, Dalian University of Technology. And his research interests include ultraprecision grinding of wafers.

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Zhi-Gang Dong received the Ph.D. degree in Engineering from the Dalian University of Technology, Dalian, China, in 2010. He is currently with the Dalian University of Technology, Dalian, China. His research interests include efficient processing technology and equipment for difficult-to-machine materials and precision/ultraprecision machining technology and equipment.

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Ren-Ke Kang is the professor and doctoral supervisor of the school of mechanical engineering, Dalian University of Technology. His research interests are ultra-precision machining process and ultra-precision equipment.

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Shang Gao received the Ph.D. degree in Engineering from the Dalian University of Technology, Dalian, China, in 2014. He is currently with the Dalian University of Technology, Dalian, China. His research interests include semiconductor manufacturing technology and precision/ultraprecision machining technology.

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Abstract

Back grinding of wafer with outer rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. At present, the effects of process parameters on the grinding force remain debatable. Therefore, a BGWOR normal grinding force model based on grain depth-of-cut was established, and the relationship between grinding parameters (wheel infeed rate, wheel rotational speed, and chuck rotational speed) and normal grinding force was discussed. Further, a series of experiments were performed to verify the BGWOR normal grinding force model. This study proves that the BGWOR normal grinding force is related to the rotational direction of the wheel and chuck, and the effect of grinding mark density on the BGWOR normal grinding force cannot be ignored. Moreover, this study provides methods for reducing the grinding force and optimizing the back thinning process of the silicon wafer.

Keywords

Silicon wafer / Back grinding of wafer with outer rim (BGWOR) / Grinding force / Grinding mark density

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Xiang-Long Zhu, Yu Li, Zhi-Gang Dong, Ren-Ke Kang, Shang Gao. Study into grinding force in back grinding of wafer with outer rim. Advances in Manufacturing, 2020, 8(3): 361-368 DOI:10.1007/s40436-020-00316-z

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Funding

the National Key Research and Development Program of China(2016YFB1102205)

National Natural Science Foundation of China http://dx.doi.org/10.13039/501100001809(51775084)

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