Nano-machining of materials: understanding the process through molecular dynamics simulation

Dan-Dan Cui , Liang-Chi Zhang

Advances in Manufacturing ›› 2017, Vol. 5 ›› Issue (1) : 20 -34.

PDF
Advances in Manufacturing ›› 2017, Vol. 5 ›› Issue (1) : 20 -34. DOI: 10.1007/s40436-016-0155-4
Article

Nano-machining of materials: understanding the process through molecular dynamics simulation

Author information +
History +
PDF

Abstract

Molecular dynamics (MD) simulation has been widely applied in various complex, dynamic processes at atomistic scale, because an MD simulation can provide some deformation details of materials in nano-processing and thus help to investigate the critical and important issues which cannot be fully revealed by experiments. Extensive research with the aid of MD simulation has provided insights for the development of nanotechnology. This paper reviews the fundamentals of nano-machining from the aspect of material structural effects, such as single crystalline, polycrystalline and amorphous materials. The classic MD simulations of nano-indentation and nano-cutting which have aimed to investigate the machining mechanism are discussed with respect to the effects of tool geometry, material properties and machining parameters. On nano-milling, the discussion focuses on the understanding of the grooving quality in relation to milling conditions.

Keywords

Molecular dynamics / Nano-milling / Nano-indentation / Nano-cutting / Groove quality / Multi-grooving

Cite this article

Download citation ▾
Dan-Dan Cui, Liang-Chi Zhang. Nano-machining of materials: understanding the process through molecular dynamics simulation. Advances in Manufacturing, 2017, 5(1): 20-34 DOI:10.1007/s40436-016-0155-4

登录浏览全文

4963

注册一个新账户 忘记密码

References

[1]

Chae J, Park S, Freiheit T. Investigation of micro-cutting operations. Int J Mach Tools Manuf, 2006, 46: 313-332.

[2]

Malekian M, Park SS, Jun MB. Tool wear monitoring of micro-milling operations. J Mater Process Technol, 2009, 209: 4903-4914.

[3]

Zhang LC, Tanaka H. On the Mechanics and Physics in the Nano-Indentation of Silicon Monocrystals. JSME Int J Ser A Solid Mech Mater Eng, 1999, 42: 546-559.

[4]

Cheong WCD, Zhang LC. Molecular dynamics simulation of phase transformations in silicon monocrystals due to nano-indentation. Nanotechnology, 2000, 11: 173.

[5]

Tang C, Zhang LC. A molecular dynamics analysis of the mechanical effect of water on the deformation of silicon monocrystals subjected to nano-indentation. Nanotechnology, 2004, 16: 15.

[6]

Kim D, Oh S. Atomistic simulation of structural phase transformations in monocrystalline silicon induced by nanoindentation. Nanotechnology, 2006, 17: 2259.

[7]

Minor AM, Asif SS, Shan Z, et al. A new view of the onset of plasticity during the nanoindentation of aluminium. Nat Mater, 2006, 5: 697-702.

[8]

Kim KJ, Yoon JH, Cho MH, et al. Molecular dynamics simulation of dislocation behavior during nanoindentation on a bicrystal with a Σ = 5 (210) grain boundary. Mater Lett, 2006, 60: 3367-3372.

[9]

Li J, Guo J, Luo H. Study of nanoindentation mechanical response of nanocrystalline structures using molecular dynamics simulations. Appl Surf Sci, 2016, 364: 190-200.

[10]

Szlufarska I, Kalia RK, Nakano A, et al. A molecular dynamics study of nanoindentation of amorphous silicon carbide. J Appl Phys, 2007, 102: 23509.

[11]

Qiu C, Zhu P, Fang F, et al. Study of nanoindentation behavior of amorphous alloy using molecular dynamics. Appl Surf Sci, 2014, 305: 101-110.

[12]

Bei H, George EP, Hay J, et al. Influence of indenter tip geometry on elastic deformation during nanoindentation. Phys Rev Lett, 2005, 95: 045501.

[13]

Shih C, Yang M, Li J. Effect of tip radius on nanoindentation. J Mater Res, 1991, 6: 2623-2628.

[14]

Cheong WCD, Zhang LC, Tanaka H (2001) Some essentials of simulating nano-surfacing processes using the molecular dynamics method. In: Key Engineering Materials, Trans Tech Publ, 2001, pp. 31–42

[15]

Zhang LC, Cheong WCD. Molecular dynamics simulation of phase transformations in monocrystalline silicon. High Press Surf Sci Eng, 2003, 57: 285

[16]

Cheong WCD, Zhang LC. Monocrystalline silicon subjected to multi-asperity sliding: nano-wear mechanisms, subsurface damage and effect of asperity interaction. Int J Mater Prod Technol, 2003, 18: 398-407.

[17]

Zhang LC, Johnson K, Cheong WCD. A molecular dynamics study of scale effects on the friction of single-asperity contacts. Tribol Lett, 2001, 10: 23-28.

[18]

Davis JR. Properties and selection: nonferrous alloys and special-purpose materials. ASM Intl, 1990, 2: 1770

[19]

Pei Q, Lu C, Fang F, Wu H. Nanometric cutting of copper: a molecular dynamics study. Comput Mater Sci, 2006, 37: 434-441.

[20]

Komanduri R, Chandrasekaran N, Raff L. Some aspects of machining with negative-rake tools simulating grinding: a molecular dynamics simulation approach. Philos Mag B, 1999, 79: 955-968.

[21]

Han X (2006) Investigation micro-mechanism of dry polishing using molecular dynamics simulation method. In: 1st IEEE international conference on nano/micro engineered and molecular systems 2006. NEMS’06, pp. 936–941

[22]

Komanduri R, Chandrasekaran N, Raff L. Effect of tool geometry in nanometric cutting: a molecular dynamics simulation approach. Wear, 1998, 219: 84-97.

[23]

Han X, Lin B, Yu S, et al. Investigation of tool geometry in nanometric cutting by molecular dynamics simulation. J Mater Process Technol, 2002, 129: 105-108.

[24]

Komanduri R, Ch and Rasekaran N, Raff L (2001) Molecular dynamics simulation of the nanometric cutting of silicon. Philos Mag B 81:1989–2019

[25]

Zhao HW, Zhang L, Zhang P, et al. Influence of geometry in nanometric cutting single-crystal copper via MD simulation. Adv Mater Res, 2012, 421: 123-128.

[26]

Fang F, Wu H, Zhou W, et al. A study on mechanism of nano-cutting single crystal silicon. J Mater Process Technol, 2007, 184: 407-410.

[27]

Zhang LC, Tanaka H. Towards a deeper understanding of wear and friction on the atomic scale—a molecular dynamics analysis. Wear, 1997, 211: 44-53.

[28]

Zhang LC, Tanaka H. Atomic scale deformation in silicon monocrystals induced by two-body and three-body contact sliding. Tribol Int, 1998, 31: 425-433.

[29]

Movahhedy M, Altintas Y, Gadala M. Numerical analysis of metal cutting with chamfered and blunt tools. J Manuf Sci Eng, 2002, 124: 178-188.

[30]

Komanduri R, Chandrasekaran N, Raff L. MD Simulation of nanometric cutting of single crystal aluminum-effect of crystal orientation and direction of cutting. Wear, 2000, 242: 60-88.

[31]

Li J. high-angle tilt boundary—a dislocation core model. J Appl Phys, 1961, 32: 525-541.

[32]

Mylvaganam K, Zhang LC (2010) Effect of nano-scratching direction on the damage in monocrystalline silicon. In: Proceedings of the 6th Australasian congress on applied mechanics, Engineers Australia, p 757

[33]

Komanduri R, Chandrasekaran N, Raff L. MD simulation of indentation and scratching of single crystal aluminum. Wear, 2000, 240: 113-143.

[34]

Pei Q, Lu C, Lee H. Large scale molecular dynamics study of nanometric machining of copper. Comput Mater Sci, 2007, 41: 177-185.

[35]

Zhu YT, Langdon TG. Influence of grain size on deformation mechanisms: an extension to nanocrystalline materials. Mater Sci Eng A, 2005, 409: 234-242.

[36]

Van Swygenhoven H, Caro A, Farkas D. A molecular dynamics study of polycrystalline FCC metals at the nanoscale: grain boundary structure and its influence on plastic deformation. Mater Sci Eng A, 2001, 309: 440-444.

[37]

Qi Y, Krajewski PE. Molecular dynamics simulations of grain boundary sliding: the effect of stress and boundary misorientation. Acta Mater, 2007, 55: 1555-1563.

[38]

Zhang J, Hartmaier A, Wei Y, et al. Mechanisms of anisotropic friction in nanotwinned Cu revealed by atomistic simulations. Model Simul Mater Sci Eng, 2013, 21: 065001.

[39]

Ye Y, Biswas R, Morris J, et al. Molecular dynamics simulation of nanoscale machining of copper. Nanotechnology, 2003, 14: 390.

[40]

Fang TH, Weng CI. Three-dimensional molecular dynamics analysis of processing using a pin tool on the atomic scale. Nanotechnology, 2000, 11: 148.

[41]

Zhu PZ, Hu YZ, Ma TB, et al. Study of AFM-based nanometric cutting process using molecular dynamics. Appl Surf Sci, 2010, 256: 7160-7165.

[42]

Li J, Liu B, Luo H, et al. A molecular dynamics investigation into plastic deformation mechanism of nanocrystalline copper for different nanoscratching rates. Comput Mater Sci, 2016, 118: 66-76.

[43]

Chen J, Liang Y, Chen M, et al. Multi-path nanometric cutting of molecular dynamics simulation. J Comput Theor Nanosci, 2012, 9: 1303-1308.

[44]

Oluwajobi A, Chen X. Multi-pass nanometric machining simulation using the molecular dynamics (MD). Key Eng Mater, 2012, 496: 241-246.

[45]

Cui DD, Zhang LC, Mylvaganam K et al (2015) Nano-milling on monocrystalline copper: a molecular dynamics simulation. Mach Sci Technol

[46]

Cui DD, Mylvaganam K, Zhang LC (2012) Atomic-scale grooving on copper: end-milling versus peripheral-milling. In: Advanced materials research, Trans Tech Publ, pp 546–551

[47]

Cui DD, Zhang LC, Mylvaganam K. Nano-milling on copper: grooving quality and critical depth of cut. J Comput Theor Nanosci, 2014, 11: 964-970.

[48]

Bao W, Tansel I. Modeling micro-end-milling operations. Part I: analytical cutting force model. Int J Mach Tools Manuf, 2000, 40: 2155-2173.

[49]

Wang Z, Jiao N, Tung S, et al. Atomic force microscopy-based repeated machining theory for nanochannels on silicon oxide surfaces. Appl Surf Sci, 2011, 257: 3627-3631.

[50]

Zhang LC, Tanaka H. On the mechanics and physics in the nano-indentation of silicon monocrystals. JSME Int J, 1999, 42: 546-559.

AI Summary AI Mindmap
PDF

164

Accesses

0

Citation

Detail

Sections
Recommended

AI思维导图

/