Integrated color defect detection method for polysilicon wafers using machine vision

Abstract

For the typical color defects of polysilicon wafers, i.e., edge discoloration, color inaccuracy and color non-uniformity, a new integrated machine vision detection method is proposed based on an HSV color model. By transforming RGB image into three-channel HSV images, the HSV model can efficiently reduce the disturbances of complex wafer textures. A fuzzy color clustering method is used to detect edge discoloration by defining membership function for each channel image. The mean-value classifying method and region growing method are used to identify the other two defects, respectively. A vision detection system is developed and applied in the production of polysilicon wafers.

Keywords

Polysilicon wafers / Color defect detection / Machine vision / Fuzzy color clustering / Region growing method

References

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