Analysis and simulation of high-power LED array with microchannel heat sink

Xin Zhang , Ru-Chun Li , Qi Zheng

Advances in Manufacturing ›› 2013, Vol. 1 ›› Issue (2) : 191 -195.

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Advances in Manufacturing ›› 2013, Vol. 1 ›› Issue (2) : 191 -195. DOI: 10.1007/s40436-013-0027-0
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Analysis and simulation of high-power LED array with microchannel heat sink

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Abstract

The high power light emitting diode (LED) array integrated with the microchannel heat sink is designed in this paper, and then optimal analysis and simulation have been carried out. According to the theory of heat transfer and fluid mechanics, the calculation of the thermal resistance for the microchannel heat sink is obtained, and the thermal resistance is minimized. Finally the simulation with FLUENT software is developed to verify the theoretical analysis. Established analysis and simulation show that the width of the cooling channel is 0.1 mm, and the cooling water flow rate is 1 m/s. On the other hand, the system acquires the best heat dissipation effect, and the minimum of thermal resistance is 0.019 W/°C.

Keywords

High-power LED array / Microchannel heat sink / Thermal resistance / Analytical solution / Optimized simulation

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Xin Zhang, Ru-Chun Li, Qi Zheng. Analysis and simulation of high-power LED array with microchannel heat sink. Advances in Manufacturing, 2013, 1(2): 191-195 DOI:10.1007/s40436-013-0027-0

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