New generation of solid state coolers

Abstract

Recent developments in the field of solid-state cooling devices both thermoelectric (ТЕ) and thermionic ones (TI) are considered in the article. The development of quantum superlattice allows to design ТЕ microcoolers with the density of the removed heat flux upto 1 k W/cm2 for spot cooling of chips. Tunnel thermal diodes allow to improve TI coolers by bringing the density of the heat flux being removed to 5 k W/cm2 and the temperature to 150 K.

Keywords

thermoelectrics / thermal control / thermal stabilization

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RIGHTS & PERMISSIONS

Bulat L.P.