Design of low-alloying and high-performance solid solution-strengthened copper alloys with element substitution for sustainable development
Jiaqiang Li, Hongtao Zhang, Jingtai Sun, Huadong Fu, Jianxin Xie
Design of low-alloying and high-performance solid solution-strengthened copper alloys with element substitution for sustainable development
Solid solution-strengthened copper alloys have the advantages of a simple composition and manufacturing process, high mechanical and electrical comprehensive performances, and low cost; thus, they are widely used in high-speed rail contact wires, electronic component connectors, and other devices. Overcoming the contradiction between low alloying and high performance is an important challenge in the development of solid solution-strengthened copper alloys. Taking the typical solid solution-strengthened alloy Cu–4Zn–1Sn as the research object, we proposed using the element In to replace Zn and Sn to achieve low alloying in this work. Two new alloys, Cu–1.5Zn–1Sn–0.4In and Cu–1.5Zn–0.9Sn–0.6In, were designed and prepared. The total weight percentage content of alloying elements decreased by 43% and 41%, respectively, while the product of ultimate tensile strength (UTS) and electrical conductivity (EC) of the annealed state increased by 14% and 15%. After cold rolling with a 90% reduction, the UTS of the two new alloys reached 576 and 627 MPa, respectively, the EC was 44.9%IACS and 42.0%IACS, and the product of UTS and EC (UTS × EC) was 97% and 99% higher than that of the annealed state alloy. The dislocations proliferated greatly in cold-rolled alloys, and the strengthening effects of dislocations reached 332 and 356 MPa, respectively, which is the main reason for the considerable improvement in mechanical properties.
element substitution / copper alloy / solid solution strengthening / microstructure and performance
[[1]] |
|
[[2]] |
C.Z. Huang, Y.B. Jiang, Z.X. Wu, et al., Significantly enhanced high-temperature mechanical properties of Cu–Cr–Zn–Zr–Si alloy with stable second phases and grain boundaries, Mater. Des., 233(2023), art. No. 112292.
|
[[3]] |
|
[[4]] |
|
[[5]] |
H. Zhang, X.C. Deng, and G.H. Zhang, Preparation and properties of multiphase solid-solution strengthened high-performance W–Cu alloys through alloying with Mo, Fe and Ni, Mater. Sci. Eng. A, 871(2023), art. No. 144909.
|
[[6]] |
S.W. Huang, P.F. Zhou, F.X. Luo, et al., Effects of Ni and Mn contents on precipitation and strengthening behavior in Cu–Ni–Mn ternary alloys, Mater. Charact., 199(2023), art. No. 112775.
|
[[7]] |
|
[[8]] |
|
[[9]] |
|
[[10]] |
|
[[11]] |
|
[[12]] |
|
[[13]] |
|
[[14]] |
|
[[15]] |
|
[[16]] |
|
[[17]] |
|
[[18]] |
|
[[19]] |
|
[[20]] |
J.Z. Li, H. Ding, B.M. Li, W.L. Gao, J. Bai, and G. Sha, Effect of Cr and Sn additions on microstructure, mechanical-electrical properties and softening resistance of Cu–Cr–Sn alloy, Mater. Sci. Eng. A, 802(2021), art. No. 140628.
|
[[21]] |
|
[[22]] |
|
[[23]] |
|
[[24]] |
|
[[25]] |
|
[[26]] |
K. Yamaguchi, T. Ishigaki, Y. Inoue, et al., Comprehensive elemental screening of solid-solution copper alloys, Sci. Technol. Adv. Mater.: Methods, 3(2023), No. 1, art. No. 2250704.
|
[[27]] |
|
/
〈 | 〉 |