High performance 1 mm AlGaN/GaN HEMT based on SiC substrate

Front. Electr. Electron. Eng. ›› 2008, Vol. 3 ›› Issue (1) : 120 -122.

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Front. Electr. Electron. Eng. ›› 2008, Vol. 3 ›› Issue (1) : 120 -122. DOI: 10.1007/s11460-008-0020-8

High performance 1 mm AlGaN/GaN HEMT based on SiC substrate

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Abstract

This is our first report on the high performance 1 mm AlGaN/GaN high electron mobility transistor (HEMT) which was developed using home-made AlGaN/GaN epitaxy structures based on SiC substrate. Metal-organic chemical vapor deposition (MOCVD) was used to generate the epitaxy layers. Corresponding experiments show that the device has a gate length of 0.8 ?m exhibiting drain current density of 1.16 A/mm, transconductance of 241 ms/mm, a gate-drain breakdown voltage larger than 80 V, maximum current gain frequency of 20 GHz and maximum power gain frequency of 28 GHz. In addition, the power gain under the continues wave condition is 14.2 dB with a power density of 4.1 W/mm, while under the pulsed wave condition, power gain reaches 14.4 dB with power density at 5.2 W/mm. Furthermore, the two-port network impedance characteristics display great potential in microwave application.

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AlGaN/GaN / high electron mobility transistor (HEMT) / microwave power, power gain

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null. High performance 1 mm AlGaN/GaN HEMT based on SiC substrate. Front. Electr. Electron. Eng., 2008, 3(1): 120-122 DOI:10.1007/s11460-008-0020-8

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