A novel MEMS-based focal plane array for infrared imaging

doi:10.1007/s11460-007-0015-x

Front. Electr. Electron. Eng. ›› 2007, Vol. 2 ›› Issue (1) :83 -87. DOI: 10.1007/s11460-007-0015-x

LI Chaobo¹, JIAO Binbin¹, SHI Shali¹, YE Tianchun¹, CHEN Dapeng¹, ZHANG Qingchuan², GUO Zheying², DONG Fengliang², WU Xiaoping²

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Abstract

On the basis of opto-mechanical effect and micro electromechanical system (MEMS) technology, a novel substrate-free focal plane array (FPA) with the thermal isolated structure for uncooled infrared imaging is developed, even as alternate evaporated Au on SiN cantilever is used for thermal isolation. A human thermal image is obtained successfully by using the infrared imaging system composed of the FPA and optical detecting system. The experiment results show that the realization of thermal isolation structure in substrate-free FPA increases the temperature rise of the deflecting leg effectively, whereas the noise equivalent temperature difference (NETD) is about 200 mK.

Keywords

MEMS, focal plane array (FPA), optomechanical, low-pressure chemical vapor deposition (LPCVD), SiN_x, NETD

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LI Chaobo, JIAO Binbin, SHI Shali, YE Tianchun, CHEN Dapeng, ZHANG Qingchuan, GUO Zheying, DONG Fengliang, WU Xiaoping. A novel MEMS-based focal plane array for infrared imaging. Front. Electr. Electron. Eng., 2007, 2(1): 83-87 DOI:10.1007/s11460-007-0015-x