Effect of Sodium Alcohol Thiyl Propane Sulfonate on Electrolysis of High Performance Copper Foil for Lithium Ion Batteries

Sen Yang , Wen-Chang Wang , Ran Zhang , Shui-Ping Qin , Min-Xian Wu , Naotoshi Mitsuzaki , Zhi-Dong Chen

Journal of Electrochemistry ›› 2022, Vol. 28 ›› Issue (6) : 2104501 -2104501.

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Journal of Electrochemistry ›› 2022, Vol. 28 ›› Issue (6) :2104501 -2104501. DOI: 10.13208/j.electrochem.210450
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Effect of Sodium Alcohol Thiyl Propane Sulfonate on Electrolysis of High Performance Copper Foil for Lithium Ion Batteries
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Abstract

Electrolytic copper foils have been widely used in printed circuit boards and lithium-ion batteries due to their simple production process and high economic value. In the process of electrolysis foil making, additives can greatly improve the performance of electrolytic copper foils. In this work, the copper foils were prepared in a self-designed plate electrodeposition device of which the operating principles were in accordance with those of actual industrial production. A series of the Virgin Make-up Solution (VMS: 312.5 g·L-1 CuSO4·5H2O, 100 g·L-1 H2SO4, 50 mg·L-1 Cl-) containing different additives was investigated to study the electrochemical behaviors of the electrolytes and their effects on the surface morphology, structure, and properties of the electrolytic copper foils. The results showed that HP had a strong depolarization effect in the combined additive system, which can accelerate the growth of copper nuclei, and had the optimal growth orientation of the enhanced copper (200) crystal surface. HVP had adsorption effect on the cathode surface and formed a barrier layer on the cathode active site, which inhibits the electrical deposition of copper. DPS had a strong depolarization effect at low concentration, with the high concentration, a polarization effect reduced the grain size. When HP and DPS coexisted, there was a competitive adsorption, showing certain polarization effect. The synergistic effect of HP with DPS and HVP could further reduce the grain size of electrolytic copper foils, reduce the surface roughness, and improve the mechanical properties and corrosion resistance of the coatings. The obtained electrolytic copper foils were uniformly dense, with an average grain size of 29.2 nm, an average roughness of 1.12 μm. and an average tensile strength of 399.5 MPa. The electrolytic copper foils obtained exhibited the superior corrosion resistance, became the ideal materials for lithium-ion battery anode fluid collection, and had high commercial value. Subsequently, the effects of DPS and HVP in the combined additive system on the surface morphology and physical properties of copper foil will be investigated to further explore the action mechanism of the combined additive and improve the electrodeposition model.

Keywords

electrolytic copper foil / additives / electrochemical / tensile strength / corrosion resistant

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Sen Yang, Wen-Chang Wang, Ran Zhang, Shui-Ping Qin, Min-Xian Wu, Naotoshi Mitsuzaki, Zhi-Dong Chen. Effect of Sodium Alcohol Thiyl Propane Sulfonate on Electrolysis of High Performance Copper Foil for Lithium Ion Batteries. Journal of Electrochemistry, 2022, 28(6): 2104501-2104501 DOI:10.13208/j.electrochem.210450

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References

[1]

Wang C B, Yin L W, Xiang D, Qi Y X. Uniform carbon layer coated Mn3O4 nanorod anodes with improved re-versible capacity and cyclic stability for lithium ion batter-ies[J]. ACS Appl. Mater. Interfaces, 2012, 4(3): 1636-1642.

[2]

Varghese S P, Babu B, Prasannachandran R, Antony R, Shaijumon M M. Enhanced electrochemical properties of Mn3O4/graphene nanocomposite as efficient anode materi-al for lithium ion batteries[J]. J. Alloy. Compd., 2019, 780: 588-596.

[3]

An C S, Zhang B, Tang L B, Xiao B, He Z J, Zheng J C. Binder-free carbon-coated TiO2@graphene electrode by using copper foam as current collector as a high-perfor-mance anode for lithium ion batteries[J]. Ceram. Int., 2019, 45(10): 13144-13149.

[4]

Zuo T T, Wu X W, Yang C P, Yin Y X, Ye H, Li N W, Guo Y G. Graphitized carbon fibers as multifunctional 3D current collectors for high areal capacity Li anodes[J]. Adv. Mater., 2017, 29(29): 1700389.

[5]

An G H, Cha S N, Ahn H J. Surface functionalization of the terraced surface-based current collector for a superca-pacitor with an improved energy storage performance[J]. Appl. Surf. Sci., 2019, 478: 435-440.

[6]

Shin D Y, Park D H, Ahn H J. Interface modification of an Al current collector for ultrafast lithium-ion batteries[J]. Appl. Surf. Sci., 2019, 475: 519-523.

[7]

Lu L L, Ge J, Yang J N, Chen S M, Yao H B, Zhou F, Yu S H. Free-standing copper nanowire network current collector for improving lithium anode performance[J]. Nano Lett., 2016, 16(7): 4431-4437.

[8]

Park H, Um J H, Choi H, Yoon W S, Sung Y E, Choe H. Hierarchical micro-lamella-structured 3D porous copper current collector coated with tin for advanced lithium-ion batteries[J]. Appl. Surf. Sci., 2017, 399: 132-138.

[9]

Cui Y, Fu Y Z. Enhanced cyclability of Li/polysulfide batteries by a polymer-modified carbon paper current col-lector[J]. ACS Appl. Mater. Interfaces, 2015, 7(36): 20369-20376.

[10]

Jin L(金磊), Yang J Q(杨家强), Yang F Z(杨防祖), Zhan D P(詹东平), Tian Z Q(田中群), Zhou S M(周绍民). Research progresses of copper interconnection in chips[J]. J. Electrochem.(电化学), 2020, 26(4): 521-530.

[11]

Yin L(殷列), Wang Z L(王增林). Behavior of copper electrodeposition in copper electroplating solution with different PEG molecular weight[J]. J. Electrochem.(电化学), 2008, 14(4): 431-435.

[12]

Meudre C, Ricq L, Hihn J Y, Moutarlier V, Monnin A, Heintz O. Adsorption of gelatin during electrodeposition of copper and tin-copper alloys from acid sulfate elec-trolyte[J]. Surf. Coat. Technol., 2014, 252: 93-101.

[13]

Dutra A J B, O'Keefe T J. Copper nucleation on titanium for thin film applications[J]. J. Appl. Electrochem., 1999, 29(10): 1217-1227.

[14]

Lee Y K, O’Keefe T J. Evaluating and monitoring nucle-ation and growth in copper foil[J]. JOM-J. Miner. Met. Mater. Soc., 2002, 54(4): 37-41.

[15]

Zhong Q(钟琴).Effect of additives MPS, PEG, Cl- on ele-ctrodeposition of copper[D]. Chongqing: Chongqing Uni-versity, 2010.

[16]

Wang Y(王义). Study on the properties and mechanism of copper microvia filling additive[D]. Jiangxi: Jiangxi University of Science and Technology, 2018.

[17]

Dow W P, Li C C, Lin M W, Su G W, Huang C C. Copper fill of microvia using a thiol-modified Cu seed layer and various levelers[J]. J. Electrochem. Soc., 2009, 156(8): D314-D320.

[18]

Tan M, Guymon C, Wheeler D R, Harb J N. The role of SPS, MPSA, and chloride in additive systems for copper electrodeposition[J]. J. Electrochem. Soc., 2007, 154(2): D78-D81.

[19]

Zhang Q B, Hua Y X, Wang Y T, Lu H J, Zhang X Y. Effects of ionic liquid additive [BMIM HSO 4 on copper electro-deposition from acidic sulfate electrolyte[J]. Hy-drometallurgy, 2009, 98(3-4): 291-297.

[20]

Wang X M, Wang K, Xu J, Li J, Lv J E, Zhao M, Wang L M. Quinacridone skeleton as a promising efficient lev-eler for smooth and conformal copper electrodeposition[J]. Dyes Pigment., 2020, 181: 108594.

[21]

Wang Z Q, Gong Y L, Jing C, Huang H J, Li H R, Zhang S T, Gao F. Synthesis of dibenzotriazole derivatives bear-ing alkylene linkers as corrosion inhibitors for copper in sodium chloride solution: A new thought for the design of organic inhibitors[J]. Corrosion Sci., 2016, 113: 64-77.

[22]

Li C C, Guo X Y, Shen S, Song P, Xu T, Wen Y, Yang H F. Adsorption and corrosion inhibition of phytic acid cal-cium on the copper surface in 3wt% NaCl solution[J]. Corrosion Sci., 2014, 83: 147-154.

[23]

Tang M X, Zhang S T, Qiang Y J, Chen S J, Luo L, Gao J Y, Feng L, Qin Z J. 4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplat-ing copper[J]. RSC Adv., 2017, 7(64): 40342-40353.

[24]

Varvara S, Muresan L, Popescu I C, Maurin G. Compara-tive study of copper electrodeposition from sulphate acidic electrolytes in the presence of IT-85 and of its components[J]. J. Appl. Electrochem., 2005, 35(1): 69-76.

[25]

Liu Y, Li S Y, Zhang J J, Liu J A, Han Z W, Ren L Q. Corrosion inhibition of biomimetic super-hydrophobic electrodeposition coatings on copper substrate[J]. Corro-sion Sci., 2015, 94: 190-196.

[26]

Hernandez-Viezcas J A, Castillo-Michel H, Andrews J C, Cotte M, Rico C, Peralta-Videa J R, Ge Y, Priester J H, Holden P A,Gardea-Torresdey J L. In situ synchrotron X-ray fluorescence mapping and speciation of CeO2 and ZnO nanoparticles in soil cultivated soybean (Glycine max)[J]. ACS Nano, 2013, 7(2): 1415-1423.

[27]

Mishra R, Balasubramaniam R. Effect of nanocrystalline grain size on the electrochemical and corrosion behavior of nickel[J]. Corrosion Sci., 2004, 46(12): 3019-3029.

[28]

Pang N, Chen L. Effect of substrate orientation on critical thickness of Cu thin films[J]. Electron. Mater. Lett., 2011, 7(4): 359-363.

[29]

Lu L, Chen X, Huang X, Lu K. Revealing the maximum strength in nanotwinned copper[J]. Science., 2009, 323 (5914): 607-610.

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