Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)

Abstract

This work presents a novel design of Ka-band (33 GHz) filtering packaging antenna (FPA) that features broadband and great filtering response, and is based on glass packaging material and through-glass via (TGV) technologies. Compared to traditional packaging materials (printed circuit board, low temperature co-fired ceramic, Si, etc.), TGVs are more suitable for miniaturization (millimeter-wave three-dimensional (3D) packaging devices) and have superior microwave performance. Glass substrate can realize 3D high-density interconnection through bonding technology, while the coefficient of thermal expansion (CTE) matches that of silicon. Furthermore, the stacking of glass substrate enables high-density interconnections and is compatible with micro-electro-mechanical system technology. The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter (BPF) whose reflection coefficients are almost complementary. The BPF unit has three pairs of λ_g/4 slots (defect microstrip structure, DMS) and two λ_g/2 U-shaped slots (defect ground structure, DGS). The proposed antenna achieves large bandwidth and high radiation efficiency, which may be related to the stacking of glass substrate and TGV feed. In addition, the introduction of four radiation nulls can effectively improve the suppression level in the stopband. To demonstrate the performance of the proposed design, a 33-GHz broadband filtering antenna is optimized, debugged, and measured. The antenna could achieve |S₁₁|<-10 dB in 29.4-36.4 GHz, and yield an impedance matching bandwidth up to 21.2%, with the stopband suppression level at higher than 16.5 dB. The measurement results of the proposed antenna are a realized gain of ~6.5 dBi and radiation efficiency of ~89%.

Keywords

Filtering packaging antenna (FPA) / Through-glass vias (TGVs) / 3D packaging devices / Laser bonding

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2023 Zhejiang University Press