%A Ching-Ping WONG, Wei LIN, Ling-Bo ZHU, Hong-Jin JIANG, Rong-Wei ZHANG, Yi LI, Kyoung-Sik MOON, %T Nano materials for microelectronic and photonic packaging %0 Journal Article %D 2010 %J Front. Optoelectron. %J Frontiers of Optoelectronics %@ 2095-2759 %R 10.1007/s12200-010-0009-9 %P 139-142 %V 3 %N 2 %U {https://journal.hep.com.cn/foe/EN/10.1007/s12200-010-0009-9 %8 2010-06-05 %X This paper addresses the state-of-the-art nano-science and technology regarding next generation high density microelectronics and photonics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, and molecular wires for electrical interconnects, etc.