TY - Front. Mech. Eng. A1 - Zilian QU, Yonggang MENG, Qian ZHAO T1 - Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process Y1 - 2015-04-01 JF - Frontiers of Mechanical Engineering JO - Front. Mech. Eng. SP - 1 EP - 6 VL - 10 IS - 1 UR - https://journal.hep.com.cn/fme N1 - 10.1007/s11465-015-0325-2 ER -